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Eric PopPease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLACVerified email at stanford.edu
Wenhui DuanTsinghua University, Beijing, ChinaVerified email at tsinghua.edu.cn
Bing HuangProfessor, Beijing Computational Science Research Center & Beijing Normal UniversityVerified email at csrc.ac.cn
Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krVerified email at kriss.re.kr
Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
Yong Xu (徐勇)Professor, Department of Physics, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
Sharnali IslamUniversity of DhakaVerified email at du.ac.bd
Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
Feifei LianStanford UniversityVerified email at stanford.edu
Max ShulakerMassachusetts Institute of TechnologyVerified email at mit.edu
YUN HO KIMPrincipal Researcher, Korea Research Institute of Chemical Technology (KRICT)Verified email at krict.re.kr
Qimin YanAssociate Professor, Department of Physics, Northeastern UniversityVerified email at northeastern.edu
Juan Pablo LlinasUniversity of California, BerkeleyVerified email at berkeley.edu
Jia Li(李佳)Associate Professor, Tsinghua Shenzhen International Graduate School (Tsingua SIGS)Verified email at mail.tsinghua.edu.cn
Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
Yizhou Liu (刘易周)School of Physics Science and Engineering, Tongji UniversityVerified email at tongji.edu.cn
Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
Lucas LindsayOak Ridge National LaboratoryVerified email at ornl.gov
Michal Jakub MleczkoDevice Engineer, IntelVerified email at stanford.edu