| Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux … KW Jung, S Hazra, H Kwon, A Piazza, E Jih, M Asheghi, MP Gupta, ... Journal of Electronic Packaging 142 (3), 2020 | 36* | 2020 |
| Feasibility design of tight integration of low inductance sic power module with microchannel cooler H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022 | 16 | 2022 |
| Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers T Wei, S Hazra, Y Lin, MP Gupta, M Degner, M Asheghi, KE Goodson Journal of Electronic Packaging 145 (2), 021008, 2023 | 13 | 2023 |
| Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling S Hazra, T Wei, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner International Journal of Heat and Mass Transfer 197, 123356, 2022 | 12 | 2022 |
| Considerations and challenges for large area embedded micro-channels with 3D manifold in high heat flux power electronics applications A Piazza, S Hazra, KW Jung, M Degner, MP Gupta, E Jih, M Asheghi, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 11 | 2020 |
| Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 3-Addressing Challenges in Laser Micro-Machining Based … S Hazra, KW Jung, M Iyengar, C Malone, M Asheghi, DK Goodson Journal of Electronic Packaging, 2020 | 7* | 2020 |
| Techno-economic feasibility analysis of an extreme heat flux micro-cooler EM Dede, C Zhang, Q Wu, N Seyedhassantehrani, M Shattique, S Roy, ... Iscience 26 (1), 2023 | 6 | 2023 |
| Lasered roughness to increase wicking rates in pin-fin microstructure S Hazra, T Liu, M Asheghi, K Goodson International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 5 | 2020 |
| Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal S Hazra, A Piazza, KW Jung, M Asheghi, MP Gupta, E Jih, M Degner, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| A Novel Hardmask-to-Substrate Pattern Transfer Method for Creating 3D, Multi-level, Hierarchical, High aspect-ratio Structures for Applications in Microfluidics and Cooling … S Hazra, C Zhang, Q Wu, M Asheghi, K Goodson, EM Dede, J Palko, ... Nature Scientific Reports, 2022 | 4 | 2022 |
| Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers S Hazra, Y Singh, M Asheghi, K Goodson International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 3 | 2020 |
| Systems for cooler devices and cooling manifolds S Hazra, C Zhang, M Asheghi, KE Goodson, EM Dede, J Palko, ... US Patent App. 17/748,429, 2023 | | 2023 |
| Multi-level hierarchical hybrid structures to replace single-level wicks in next generation vapor chambers S Hazra, M Asheghi, KE Goodson, C Zhang US Patent App. 18/129,657, 2023 | | 2023 |
| Structured Microchannel Cooling technology by utilizing a novel hard mask pattern transfer fabrication process S Hazra, M Asheghi, KG Goodson US Patent App. 18/196,800, 2023 | | 2023 |
| Heat flux micro coolers having multi-stepped features and fluid wicking C Zhang, Q Wu, M Shattique, N Seyedhassantehrani, S Roy, J Palko, ... US Patent 11,729,951, 2023 | | 2023 |
| Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures C Zhang, S Hazra, Q Wu, M Asheghi, KE Goodson, E Dede, J Palko, ... US Patent App. 18/084,303, 2023 | | 2023 |
| Novel Thermal Management Solutions for Extreme Heat Flux Cooling S Hazra Stanford University, 2023 | | 2023 |
| Fabrication Feasibility Study and Techno–Economic Analysis of Scaling Up All Silicon 2–Level Manifolded Micro-Coolers to Extreme Footprint Area (> 600 Mm2) S Hazra, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner Available at SSRN 4500726, 0 | | |
| Capillary Transport Enhancement in Passive Cooler Wicks Using Uv-Laser Fabricated Hybrid Microstructure S Hazra, J Anderson, M Asheghi, K Goodson Available at SSRN 4490521, 0 | | |
Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford UniversityVerified email at stanford.edu
