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Shanyuan NiuNanjing UniversityVerified email at nju.edu.cn
R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
Boyang ZhaoArgonne National LaboratoryVerified email at anl.gov
Wolter SiemonsASMLVerified email at asml.com
Huan ZhaoWigner Distinguished Staff Fellow, Oak Ridge National LaboratoryVerified email at ornl.gov
Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
Pim Bram RossenVerified email at berkeley.edu
Rohan MishraWashington University in St. LouisVerified email at wustl.edu
Huaixun HuyanHardware development Engineer, Western DigitalVerified email at wdc.com
Mythili SurendranPostdoctoral Scholar, Lawrence Berkeley National LaboratoryVerified email at lbl.gov
Han WangUniversity of Hong KongVerified email at hku.hk
Yucheng ZhouUniversity of VirginiaVerified email at virginia.edu
Rehan KapadiaAssociate Professor, University of Southern CaliforniaVerified email at usc.edu
Jiang-Bin WuInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Jad SalmanUniversity of Wisconsin - MadisonVerified email at wisc.edu
Rafael JaramilloAssociate Professor of Materials Science and Enginering, MITVerified email at mit.edu
Patrick E. HopkinsUniversity of VirginiaVerified email at virginia.edu
Matthew MecklenburgUniversity of California, Los AngelesVerified email at ucla.edu
Kevin YeMassachusetts Institute of TechnologyVerified email at mit.edu
Debarghya SarkarResearch Scientist, IBM ResearchVerified email at mgh.harvard.edu