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Kunaljeet Tanwar
Kunaljeet Tanwar
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Verified email at mckinsey.com - Homepage
Title
Cited by
Cited by
Year
Surface diffraction study of the hydrated hematite (11¯ 02) surface
KS Tanwar, CS Lo, PJ Eng, JG Catalano, DA Walko, GE Brown Jr, ...
Surface Science 601 (2), 460-474, 2007
1232007
Pb (II) adsorption on isostructural hydrated alumina and hematite (0001) surfaces: A DFT study
SE Mason, CR Iceman, KS Tanwar, TP Trainor, AM Chaka
The Journal of Physical Chemistry C 113 (6), 2159-2170, 2009
1202009
Density functional theory study of the clean and hydrated hematite surfaces
CS Lo, KS Tanwar, AM Chaka, TP Trainor
Physical review B 75 (7), 075425, 2007
1052007
Fe (II) adsorption on hematite (0 0 0 1)
KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Geochimica et Cosmochimica Acta 73 (15), 4346-4365, 2009
802009
Hydrated α-Fe2O3 (11¯ 02) surface structure: Role of surface preparation
KS Tanwar, JG Catalano, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Surface science 601 (12), L59-L64, 2007
622007
Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same
X Zhang, SX Lin, K Tanwar
US Patent 9,299,745, 2016
582016
BEOL Cu CMP process evaluation for advanced technology nodes
K Tanwar, D Canaperi, M Lofaro, W Tseng, R Patlolla, C Penny, ...
Journal of The Electrochemical Society 160 (12), D3247, 2013
502013
Structural study of Fe (II) adsorption on hematite (11¯ 02)
KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor
Geochimica et Cosmochimica Acta 72 (14), 3311-3325, 2008
482008
Methods for fabricating integrated circuits with ruthenium-lined copper
K Tanwar, X Zhang, M He
US Patent 8,586,473, 2013
352013
Surface structure of magnetite (111) under hydrated conditions by crystal truncation rod diffraction
SC Petitto, KS Tanwar, SK Ghose, PJ Eng, TP Trainor
Surface science 604 (13-14), 1082-1093, 2010
312010
CVD-Co/Cu (Mn) integration and reliability for 10 nm node
T Nogami, M He, X Zhang, K Tanwar, R Patlolla, J Kelly, D Rath, ...
2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013
222013
Electromigration extendibility of Cu (Mn) alloy-seed interconnects, and understanding the fundamentals
T Nogami, C Penny, A Madan, C Parks, J Li, P Flaitz, A Uedono, S Chiang, ...
2012 International Electron Devices Meeting, 33.7. 1-33.7. 4, 2012
192012
BEOL integration scheme for copper CMP to prevent dendrite formation
K Tanwar
US Patent 8,669,176, 2014
102014
Surface structure and reactivity of iron oxide–water interfaces
SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka, TP Trainor
Developments in Earth and Environmental Sciences 7, 1-29, 2007
102007
Methods for fabricating integrated circuits having embedded electrical interconnects
ET Ryan, K Tanwar
US Patent 8,835,306, 2014
92014
Chapter 1 Surface Structure and Reactivity of Iron Oxide-Water Interfaces. Developments in Earth and Environmental Sciences
SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka
Amsterdam, The Netherlands: Elsevier, 2007
92007
Moisture scavenging layer for thinner barrier application in beol integration
M He, K Tanwar
US Patent 9,318,437, 2016
72016
Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal
K Tanwar, X Zhang, D Canaperi, R Patlolla
US Patent 9,275,874, 2016
72016
Performance of ultrathin alternative diffusion barrier metals for next-Generation BEOL technologies, and their effects on reliability
T Nogami, M Chae, C Penny, T Shaw, H Shobha, J Li, S Cohen, CK Hu, ...
IEEE International Interconnect Technology Conference, 223-226, 2014
62014
W.-t. Tseng, R. Patlolla, C. Penny, and C. Waskiewicz
K Tanwar, D Canaperi, M Lofaro
Journal of The Electrochemical Society 160 (12), D3247, 2013
62013
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