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Paul Kim Jo
Paul Kim Jo
Georgia Institute of Technolofy
Verified email at gatech.edu - Homepage
Title
Cited by
Cited by
Year
Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration
X Zhang, PK Jo, M Zia, GS May, MS Bakir
IEEE Electron Device Letters 38 (2), 255-257, 2016
232016
Design, fabrication, and characterization of dense compressible microinterconnects
PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017
172017
Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs)
PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir
IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018
122018
3-D integrated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
62016
Polylithic integration of 2.5-D and 3-D chiplets enabled by multi-height and fine-pitch CMIs
PK Jo, SK Rajan, JL Gonzalez, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
52020
Flexible interconnect design using a mechanically-focused, multi-objective genetic algorithm
JL Gonzalez, PK Jo, R Abbaspour, MS Bakir
Journal of Microelectromechanical Systems 27 (4), 677-685, 2018
52018
Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems
PK Jo, M Zia, JL Gonzalez, MS Bakir
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017
52017
Polylithic integration for RF/MM-Wave chiplets using stitch-chips: Modeling, fabrication, and characterization
T Zheng, PK Jo, SK Rajan, MS Bakir
2020 IEEE/MTT-S International Microwave Symposium (IMS), 1035-1038, 2020
42020
A disposable and self-aligned 3-D integrated bio-sensing interface module for CMOS cell-based biosensor applications
JL Gonzalez, PK Jo, R Abbaspour, MS Bakir
IEEE Electron Device Letters 39 (8), 1215-1218, 2018
42018
Heterogeneous multi-die stitching: Technology demonstration and design considerations
PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018
42018
Electrical characterization and benchmarking of polylithic integration using fused-silica stitch-chips with compressible microinterconnects for RF/mm-wave applications
T Zheng, PK Jo, SK Rajan, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
32021
Multi-die polylithic integration enabled by heterogeneous interconnect stitching technology (HIST)
PK Jo, T Zheng, MS Bakir
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018
32018
Polylithic integration of heterogeneous multi-die enabled by compressible microinterconnects
P Jo
Doctor of Philosophy, Georgia Institute of Technology, 2019
22019
Polylithic integration of 2.5 D and 3D Chiplets using interconnect stitching
PK Jo, T Zheng, MS Bakir
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1803-1808, 2019
22019
Interconnection technology innovations in 2.5 D integrated electronic systems
PA Thadesar, PK Jo, MS Bakir
Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies, 501-520, 2019
12019
Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects
H Oh, X Zhang, PK Jo, GS May, MS Bakir
2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2017
12017
Mechanically flexible interconnects, methods of making the same, and methods of use
MS Bakir, PK Jo
US Patent 10,636,731, 2020
2020
Heterogeneous Multi-Die High-Density Interconnect Stitching
PK Jo, X Zhang, JL Gonzalez, MS Bakir, ...
2018
Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects
PK Jo, M Zia, JL Gonzalez, C Zhang, MS Bakir
Advanced Packaging Technologies
PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir
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