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Feng LiuProfessor, Department of Materials Science and Engineering, University of UtahVerified email at eng.utah.edu
Tony LowU of Minnesota, IBM Research, Columbia U, Purdue U, National U SingaporeVerified email at us.ibm.com
Huaqing HuangSchool of Physics, Peking UniversityVerified email at pku.edu.cn
Jia-Wei MeiSouthern University of Science and TechnologyVerified email at sustech.edu.cn
shunhong zhangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
Zhengfei WangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
Delin ZhangSchool of Electronic and Information Engineering, Tiangong University; University of MinnesotaVerified email at tiangong.edu.cn
Yugui YaoBeijing Institute of TechnologyVerified email at bit.edu.cn
Kyung-Hwan JinDepartment of Physics, Jeonbuk National UniversityVerified email at jbnu.ac.kr
Bing HuangBeijing Computational Science Research CenterVerified email at csrc.ac.cn
Dali SunNorth Carolina State UniversityVerified email at ncsu.edu
Jiadong ZhouBeijing Institute of Technology, Nanyang Technological UniversityVerified email at bit.edu.cn
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Wei Jiang (蒋伟)
Beijing Institute of Technology, University of Minnesota, University of Utah
Verified email at bit.edu.cn - Homepage