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Co-authors
Feng LiuProfessor, Department of Materials Science and Engineering, University of UtahVerified email at eng.utah.edu- Seung-Hoon JhiDepartment of Physics, POSTECHVerified email at postech.ac.kr
- Han Woong YeomProfessor of Physics, POSTECHVerified email at postech.ac.kr
- Huaqing HuangSchool of Physics, Peking UniversityVerified email at pku.edu.cn
- Bing HuangBeijing Computational Science Research CenterVerified email at csrc.ac.cn
- Jun Sung Kim 김준성Department of Physics, POSTECHVerified email at postech.ac.kr
- Zhengfei WangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Lizhi Zhang(张礼智)Oak Ridge National Laboratory; University of Tennessee, Knoxville;University of UtahVerified email at utk.edu
- Jia-Wei MeiSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Wei Jiang (蒋伟)Beijing Institute of Technology, University of Minnesota, University of UtahVerified email at bit.edu.cn
- Tae-Hwan KimPOSTECH (Pohang University of Science and Technology)Verified email at postech.ac.kr
- Bin CuiPhysics department in Shandong University; MSE at University of UtahVerified email at sdu.edu.cn
- Chen Si (司晨)School of Material Science and Engineering, Beihang UniversityVerified email at buaa.edu.cn
- Zhimei SunDirector of Center for Integrated Computational Materials Engineering, Beihang University, ChinaVerified email at buaa.edu.cn
- Wenhui DuanTsinghua University, Beijing, ChinaVerified email at tsinghua.edu.cn
- Lih-King LimSchool of Physics, Zhejiang University, Hangzhou, ChinaVerified email at zju.edu.cn
- Xiaoming Zhang (张晓明)Ocean University of ChinaVerified email at ouc.edu.cn
- Chong LiZhengzhou UniversityVerified email at zzu.edu.cn
- Seon-Myeong ChoiSamsung
