| Junction temperature extraction approach with turn-off delay time for high-voltage high-power IGBT modules H Luo, Y Chen, P Sun, W Li, X He IEEE Transactions on Power Electronics 31 (7), 5122-5132, 2015 | 220 | 2015 |
| Investigation and classification of short-circuit failure modes based on three-dimensional safe operating area for high-power IGBT modules Y Chen, W Li, F Iannuzzo, H Luo, X He, F Blaabjerg IEEE Transactions on Power Electronics 33 (2), 1075-1086, 2017 | 62 | 2017 |
| Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum During Turn-off for High Power Trench Gate … Y Chen, H Luo, W Li, X He, F Iannuzzo, F Blaabjerg IEEE Transactions on Power Electronics 32 (8), 6394-6404, 2016 | 54 | 2016 |
| Reliability assessment of the switched reluctance motor drive under single switch chopping strategy H Chen, H Yang, Y Chen, HHC Iu IEEE Transactions on Power Electronics 31 (3), 2395-2408, 2015 | 45 | 2015 |
| Design and optimization of SiC MOSFET wire bondless power modules H Chen, MM Hossain, DG Castillo, X Li, A Wallace, Y Chen, HA Mantooth 2020 IEEE 9th international power electronics and motion control conference …, 2020 | 29 | 2020 |
| Online high-power pin diode junction temperature extraction with reverse recovery fall storage charge H Luo, Y Chen, W Li, X He IEEE Transactions on Power Electronics 32 (4), 2558-2567, 2016 | 26 | 2016 |
| A thermo-sensitive electrical parameter with maximum dIC/dt during turn-off for high power Trench/Field-Stop IGBT modules Y Chen, H Luo, W Li, X He, J Ma, G Chen, Y Tian, E Yang 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 499-504, 2016 | 25 | 2016 |
| High voltage sic power module optimized for low parasitics and compatible system interface X Li, Y Chen, Y Wu, H Chen, W Weber, A Nasiri, R Cuzner, Y Zhao, ... 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 999-1003, 2022 | 19 | 2022 |
| Feasibility design of tight integration of low inductance sic power module with microchannel cooler H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022 | 16 | 2022 |
| A Tutorial on High-Density Power Module Packaging Y Chen, A Iradukunda, HA Mantooth, Z Chen, D Huitink IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (3 …, 2022 | 13 | 2022 |
| Design and optimization of gate driver integrated multichip 3-D GaN power module AI Emon, H Carlton, J Harris, A Krone, MU Hassan, AB Mirza, M Hossain, ... IEEE Transactions on Transportation Electrification 8 (4), 4391-4407, 2022 | 13 | 2022 |
| Emi mitigation with stacking dbc substrate for high voltage power module X Li, Y Chen, H Chen, S Chinnaiyan, T Li, R Cuzner, A Nasiri, A Mantooth, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022 | 11 | 2022 |
| Average-value model of modular multilevel converters considering capacitor voltage H Yang, Y Chen, W Li, X He, W Sun, Y Chi, Y Li 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 1462-1467, 2016 | 5 | 2016 |
| 3.3 kV Low-Inductance Full SiC Power Module Y Chen, X Du, L Du, X Du, ASMK Hasan, X Li, H Chen, R Paul, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2634-2640, 2023 | 4 | 2023 |
| A nonlinear-model-based high-bandwidth current sensor design for switching current measurement of wide bandgap devices X Du, L Du, Y Chen, Y Wei, A Stratta, HA Mantooth Sensors 23 (10), 4626, 2023 | 3 | 2023 |
| A Novel Integrated 1.2 kV Double-sided Cooled Power Module R Paul, R Alizadeh, H Chen, X Li, Y Chen, HA Mantooth 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 372-377, 2023 | 2 | 2023 |
| Demonstration of wire bondless silicon carbide power module with integrated LTCC jet impingement cooler H Chen, T Wei, X Li, Y Chen, Y Lin, S Chinnaiyan, M Asheghi, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2022 | 2 | 2022 |
| Demonstration and Optimization of a 250° C LTCC-based Gate Driver for High Density, High-Temperature Power Modules S Chinnaiyan, DG Castillo, P Lai, S Ahmed, H Chen, X Li, R Paul, Y Chen, ... 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE …, 2023 | 1 | 2023 |
| Toward Direct Cooling In High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal AC Iradukunda, BM Nafis, D Huitink, Y Chen, HA Mantooth, G Campbell, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| A 4.16 kV/750kVA MV Power Conditioning System for Distribution System Applications A Rahouma, DA Porras, H Cao, Y Chen, JC Balda, Y Zhao, A Mantooth, ... 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 604-609, 2023 | | 2023 |
