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Michael Lane
Michael Lane
Emory & Henry College, Chemistry Department
Verified email at ehc.edu - Homepage
Title
Cited by
Cited by
Year
Adhesion and debonding of multi-layer thin film structures
RH Dauskardt, M Lane, Q Ma, N Krishna
Engineering Fracture Mechanics 61 (1), 141-162, 1998
7971998
Relationship between interfacial adhesion and electromigration in Cu metallization
MW Lane, EG Liniger, JR Lloyd
Journal of Applied Physics 93 (3), 1417-1421, 2003
3742003
Silicon chip carrier with conductive through-vias and method for fabricating same
DC Edelstein, PS Andry, LP Buchwalter, JA Casey, SA Goma, RR Horton, ...
US Patent 7,276,787, 2007
2662007
Adhesion and reliability of copper interconnects with Ta and TaN barrier layers
M Lane, RH Dauskardt, N Krishna, I Hashim
Journal of Materials Research 15 (1), 203-211, 2000
2352000
Liner materials for direct electrodeposition of Cu
MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg
Applied physics letters 83 (12), 2330-2332, 2003
2312003
Plasticity contributions to interface adhesion in thin-film interconnect structures
M Lane, RH Dauskardt, A Vainchtein, H Gao
Journal of materials research 15 (12), 2758-2769, 2000
2252000
Annealing-induced interfacial toughening using a molecular nanolayer
DD Gandhi, M Lane, Y Zhou, AP Singh, S Nayak, U Tisch, M Eizenberg, ...
Nature 447 (7142), 299-302, 2007
1562007
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
G Ramanath, G Cui, PG Ganesan, X Guo, AV Ellis, M Stukowski, ...
Applied Physics Letters 83 (2), 383-385, 2003
1382003
Environmental effects on interfacial adhesion
MW Lane, JM Snodgrass, RH Dauskardt
Microelectronics Reliability 41 (9-10), 1615-1624, 2001
1382001
Interface fracture
M Lane
Annual Review of Materials Research 33 (1), 29-54, 2003
1292003
Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures
MW Lane, XH Liu, TM Shaw, MG Farooq, R Hannon, IDW Melville
US Patent 7,955,955, 2011
1042011
Silicon chip carrier with conductive through-vias and method for fabricating same
D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ...
US Patent App. 11/242,221, 2006
922006
Electromigration and adhesion
JR Lloyd, MW Lane, EG Liniger, CK Hu, TM Shaw, R Rosenberg
IEEE Transactions on device and materials reliability 5 (1), 113-118, 2005
822005
SiCOH dielectric material with improved toughness and improved Si-C bonding
DC Edelstein, SM Gates, A Grill, M Lane, RD Miller, DA Neumayer, ...
US Patent 7,892,648, 2011
772011
Hardmask for reliability of silicon based dielectrics
S Van Nguyen, M Lane, SM Gates, XH Liu, VJ McGahay, SC Mehta, ...
US Patent 7,335,980, 2008
732008
Environmental effects on cracking and delamination of dielectric films
MW Lane, XH Liu, TM Shaw
IEEE Transactions on Device and Materials Reliability 4 (2), 142-147, 2004
702004
Chip-package-interaction modeling of ultra low-k/copper back end of line
XH Liu, TM Shaw, MW Lane, EG Liniger, BW Herbst, DL Questad
2007 IEEE International Interconnect Technology Conferencee, 13-15, 2007
642007
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
LA Clevenger, SR Chiras, T Dalton, JJ Demarest, DN Dunn, ...
US Patent 7,102,232, 2006
642006
Process of forming copper structures
M Lane, FR McFeely, C Murray, R Rosenberg
US Patent 6,812,143, 2004
572004
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
A Grill, D Edelstein, M Lane, V Patel, S Gates, D Restaino, S Molis
Journal of Applied Physics 103 (5), 2008
552008
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