Comparative study on multiple degrees of freedom of gate drivers for transient behavior regulation of SiC MOSFET Z Zeng, X Li IEEE Transactions on Power Electronics 33 (10), 8754-8763, 2017 | 75 | 2017 |
Layout-dominated dynamic current imbalance in multichip power module: Mechanism modeling and comparative evaluation Z Zeng, X Zhang, X Li IEEE Transactions on Power Electronics 34 (11), 11199-11214, 2019 | 56 | 2019 |
Design and optimization of SiC MOSFET wire bondless power modules H Chen, MM Hossain, DG Castillo, X Li, A Wallace, Y Chen, HA Mantooth 2020 IEEE 9th international power electronics and motion control conference …, 2020 | 29 | 2020 |
Multi‐functional grid‐connected inverter: upgrading distributed generator with ancillary services Z Zeng, X Li, W Shao IET Renewable Power Generation 12 (7), 797-805, 2018 | 28 | 2018 |
High voltage sic power module optimized for low parasitics and compatible system interface X Li, Y Chen, Y Wu, H Chen, W Weber, A Nasiri, R Cuzner, Y Zhao, ... 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 999-1003, 2022 | 19 | 2022 |
Feasibility design of tight integration of low inductance sic power module with microchannel cooler H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022 | 16 | 2022 |
Emi mitigation with stacking dbc substrate for high voltage power module X Li, Y Chen, H Chen, S Chinnaiyan, T Li, R Cuzner, A Nasiri, A Mantooth, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022 | 11 | 2022 |
Comparative evaluation of Kelvin connection for current sharing of multi-chip power modules Z Zeng, X Li, X Zhang, L Cao 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4664-4670, 2018 | 11 | 2018 |
Design and evaluation of SiC multichip power module with low and symmetrical inductance S Weihua, L Ran, Z Zheng, L Xiaoling, P Mawby The Journal of Engineering 2019 (17), 3573-3577, 2019 | 10 | 2019 |
Comparative evaluations and failure modes of wire-bonding packaged sic, si, and hybrid power modules X Li, Z Zeng, H Chen, W Shao, L Ran 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018 | 10 | 2018 |
A 10 kv sic power module stacked substrate design with patterned middle-layer for partial discharge reduction X Li, H Chen, R Paul, S Mukherjee, X Du, R Cuzner, X Song, Y Zhao, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 344-349, 2023 | 6 | 2023 |
Electro-thermal limited switching frequency for parallel diodes X Li, H Jiang, B Hu, H Chen, Z Zeng, L Ran, P Mawby 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4692-4698, 2018 | 5 | 2018 |
3.3 kV Low-Inductance Full SiC Power Module Y Chen, X Du, L Du, X Du, ASMK Hasan, X Li, H Chen, R Paul, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2634-2640, 2023 | 4 | 2023 |
SiC, Si, 混合功率模块封装对比评估与失效分析 李晓玲, 曾正, 陈昊, 邵伟华, 胡博容, 冉立 中国电机工程学报 38 (16), 4823-4835, 2018 | 4 | 2018 |
基于优化对称布局的多芯片 SiC 模块动态均流 邵伟华, 冉立, 曾正, 李晓玲, 胡博容, 廖兴林, 李辉 中国电机工程学报 38 (6), 1826-1836, 1920 | 3 | 1920 |
A Novel Integrated 1.2 kV Double-sided Cooled Power Module R Paul, R Alizadeh, H Chen, X Li, Y Chen, HA Mantooth 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 372-377, 2023 | 2 | 2023 |
Demonstration of wire bondless silicon carbide power module with integrated LTCC jet impingement cooler H Chen, T Wei, X Li, Y Chen, Y Lin, S Chinnaiyan, M Asheghi, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2022 | 2 | 2022 |
SiC MOSFET 短路特性评估及其温度依赖性模型 邵伟华, 冉立, 曾正, 李晓玲, 侯旭, 陈昊, 李辉 中国电机工程学报 38 (7), 2121-2131, 2018 | 2 | 2018 |
Demonstration and Optimization of a 250° C LTCC-based Gate Driver for High Density, High-Temperature Power Modules S Chinnaiyan, DG Castillo, P Lai, S Ahmed, H Chen, X Li, R Paul, Y Chen, ... 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE …, 2023 | 1 | 2023 |
Single Current Measurement Based Bidirectional Frequency Tracking for Unregulated Series Resonant Dab Converters L Du, H Cao, X Du, X Li, Y Zhao, HA Mantooth 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 1395-1401, 2023 | 1 | 2023 |