Zhe Chen
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In situ analysis of the tensile and tensile-creep deformation mechanisms in rolled AZ31
CJ Boehlert, Z Chen, I Gutiérrez-Urrutia, J Llorca, MT Pérez-Prado
Acta Materialia 60 (4), 1889-1904, 2012
Active slip system identification in polycrystalline metals by digital image correlation (DIC)
Z Chen, SH Daly
Experimental Mechanics 57 (1), 115-127, 2017
Characterizing microscale deformation mechanisms and macroscopic tensile properties of a high strength magnesium rare-earth alloy: A combined experimental and crystal …
A Githens, S Ganesan, Z Chen, J Allison, V Sundararaghavan, S Daly
Acta Materialia 186, 77-94, 2020
Crack opening behavior in ceramic matrix composites
KM Sevener, JM Tracy, Z Chen, JD Kiser, S Daly
Journal of the American Ceramic Society 100 (10), 4734-4747, 2017
The effects of heat treatment on the response of WE43 Mg alloy: crystal plasticity finite element simulation and SEM-DIC experiment
S Ganesan, M Yaghoobi, A Githens, Z Chen, S Daly, JE Allison, ...
International Journal of Plasticity 137, 102917, 2021
High-resolution deformation mapping across large fields of view using scanning Electron microscopy and digital image correlation
Z Chen, W Lenthe, JC Stinville, M Echlin, TM Pollock, S Daly
Experimental Mechanics 58 (9), 1407-1421, 2018
The elevated-temperature mechanical behavior of peak-aged Mg–10Gd–3Y–0.4 Zr Alloy
V Janik, DD Yin, QD Wang, SM He, CJ Chen, Z Chen, CJ Boehlert
Materials Science and Engineering: A 528 (7-8), 3105-3112, 2011
Influence of strain rate on the twin and slip activity of a magnesium alloy containing neodymium
NV Dudamell, P Hidalgo-Manrique, A Chakkedath, Z Chen, CJ Boehlert, ...
Materials Science and Engineering: A 583, 220-231, 2013
Prisms: An integrated, open-source framework for accelerating predictive structural materials science
LK Aagesen, JF Adams, JE Allison, WB Andrews, V Araullo-Peters, ...
JOM 70 (10), 2298-2314, 2018
Advanced detector signal acquisition and electron beam scanning for high resolution SEM imaging
WC Lenthe, JC Stinville, MLP Echlin, Z Chen, S Daly, TM Pollock
Ultramicroscopy 195, 93-100, 2018
Automated and quantitative analysis of plastic strain localization via multi-modal data recombination
MA Charpagne, JC Stinville, PG Callahan, D Texier, Z Chen, ...
Materials Characterization 163, 110245, 2020
In-Situ Study of the Tensile Deformation and Fracture Modes in Peak-Aged Cast Mg-11Y-5Gd-2Zn-0.5Zr (Weight Percent)
DD Yin, QD Wang, CJ Boehlert, Z Chen, HM Li, RK Mishra, A Chakkedath
Metallurgical and Materials Transactions A 47 (12), 6438-6452, 2016
In situ analysis of the tensile deformation mechanisms in extruded Mg–1Mn–1Nd (wt%)
CJ Boehlert, Z Chen, A Chakkedath, I Gutiérrez-Urrutia, J Llorca, J Bohlen, ...
Philosophical Magazine 93 (6), 598-617, 2013
Deformation twinning and detwinning in extruded Mg-4Al: in-situ experiment and crystal plasticity simulation
M Yaghoobi, Z Chen, AD Murphy-Leonard, V Sundararaghavan, S Daly, ...
International Journal of Plasticity, 103345, 2022
Deformation Twin Identification in Magnesium through Clustering and Computer Vision
Z Chen, S Daly
Materials Science and Engineering A 736, 61-75, 2018
Comparison of EBSD, DIC, AFM, and ECCI for active slip system identification in deformed Ti-7Al
R Sperry, S Han, Z Chen, SH Daly, MA Crimp, DT Fullwood
Materials Characterization 173, 110941, 2021
Measurement of elastic and rotation fields during irreversible deformation using Heaviside-digital image correlation
JC Stinville, MA Charpagne, F Bourdin, PG Callahan, Z Chen, MP Echlin, ...
Materials Characterization 169, 110600, 2020
The effect of Nd on the tension and compression deformation behavior of extruded Mg-1Mn (wt pct) at temperatures between 298 K and 523 K (25 C and 250 C)
A Chakkedath, J Bohlen, S Yi, D Letzig, Z Chen, CJ Boehlert
Metallurgical and Materials Transactions A 45 (8), 3254-3274, 2014
Time-Resolved Digital Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms
JC Stinville, T Francis, AT Polonsky, CJ Torbet, MA Charpagne, Z Chen, ...
Experimental Mechanics 61 (2), 331-348, 2021
Effect of joint scale and processing on the fracture of Sn-3Ag-0.5 Cu solder joints: application to micro-bumps in 3D packages
B Talebanpour, Z Huang, Z Chen, I Dutta
Journal of Electronic Materials 45 (1), 57-68, 2016
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