| Thermal interface materials-A review of the state of the art F Sarvar, DC Whalley, PP Conway 2006 1st electronic systemintegration technology conference 2, 1292-1302, 2006 | 327 | 2006 |
| Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt Acta Materialia 54 (11), 2907-2922, 2006 | 221 | 2006 |
| Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies Y Zhang, C Liu, D Whalley 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 103 | 2009 |
| A review of the impact of conductive adhesive technology on interconnection AO Ogunjimi, O Boyle, DC Whalley, DJ Williams Journal of Electronics Manufacturing 2 (03), 109-118, 1992 | 83 | 1992 |
| Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002 | 70 | 2002 |
| A simplified reflow soldering process model DC Whalley Journal of Materials Processing Technology 150 (1-2), 134-144, 2004 | 69 | 2004 |
| Application of adhesives in MEMS and MOEMS assembly: A review F Sarvar, DA Hutt, DC Whalley 2nd International IEEE Conference on Polymers and Adhesives in …, 2002 | 68 | 2002 |
| Conduction mechanisms in anisotropic conducting adhesive assembly CN Oguibe, SH Mannan, DC Whalley, DJ Williams Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997 | 68 | 1997 |
| Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt Acta Materialia 55 (2), 737-752, 2007 | 67 | 2007 |
| Anisotropic conducting adhesives for electronic interconnection DJ Williams, DC Whalley, OA Boyle, AO Ogunjimi Soldering & Surface Mount Technology 5 (2), 4-8, 1993 | 64 | 1993 |
| Effect of Al2O3 fibers on the thermal conductivity and mechanical properties of high density polyethylene with the absence and presence of compatibilizer S Zhang, Y Ke, X Cao, Y Ma, F Wang Journal of Applied Polymer Science 124 (6), 4874-4881, 2012 | 53 | 2012 |
| The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections DJ Williams, DC Whalley Journal of Electronics Manufacturing 3 (02), 85-94, 1993 | 42 | 1993 |
| The process modelling of the infra-red reflow soldering of printed circuit board assemblies DC WHALLEY, A OGUNJIMI, PP CONWAY, DJ WILLIAMS Journal of Electronics Manufacturing 2 (01), 23-29, 1992 | 31 | 1992 |
| Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002 | 29 | 2002 |
| Anisotropic conducting adhesives for electronic assembly DC Whalley, SH Mannan, DJ Williams Assembly Automation 17 (1), 66-74, 1997 | 28 | 1997 |
| A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan Acta Materialia 56 (19), 5668-5676, 2008 | 27 | 2008 |
| Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures AR Maligno, DC Whalley, VV Silberschmidt Microelectronics Reliability 52 (8), 1665-1678, 2012 | 25 | 2012 |
| A simplified model of the reflow soldering process DC Whalley ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 25 | 2002 |
| Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres S Jain, DC Whalley, M Cottrill, H Kristiansen, K Redford, CB Nilsen, ... 18th European Microelectronics & Packaging Conference, 1-7, 2011 | 23 | 2011 |
| Models to determine guidelines for the anisotropic conducting adhesives joining process SH Mannan, DJ Williams, DC Whalley, AO Ogunjimi Conductive adhesives for electronics packaging, 78-98, 1999 | 23 | 1999 |
Samjid H. MannanKing's College LondonVerified email at kcl.ac.uk
