Mukul Kumar

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Adam J SchwartzAmes LaboratoryVerified email at ameslab.gov
Wayne KingLawrence Livermore National LaboratoryVerified email at additivemfg.info
Bryan ReedChief Technology Officer, Integrated Dynamic Electron Solutions, Inc.Verified email at phaseplate.com
Nathan BartonProgram Group Leader, Lawrence Livermore National LaboratoryVerified email at llnl.gov
Vijay K VasudevanUniversity of North Texas; previously University of CincinnatiVerified email at unt.edu
Jonathan LindLawrence Livermore National LaboratoryVerified email at llnl.gov
James BelakLawrence Livermore National LaboratoryVerified email at llnl.gov
Christopher A SchuhMassachusetts Institute of TechnologyVerified email at mit.edu
Kevin J HemkerJohns Hopkins UniversityVerified email at jhu.edu
James StölkenLawrence Livermore National LaboratoryVerified email at llnl.gov
Damian SwiftLawrence Livermore National LaboratoryVerified email at physics.org
David FieldProfessor, School of Mechanical and Materials Engineering, Washington State UniversityVerified email at wsu.edu
Eduardo M. BringaCONICET and FCEN, Universidad Nacional de CuyoVerified email at uncu.edu.ar
Robert E RuddLawrence Livermore National LaboratoryVerified email at llnl.gov
Robert O. RitchieProfessor of Materials Science, University of California BerkeleyVerified email at lbl.gov
Marc Andre MeyersUniversity of California, San DiegoVerified email at eng.ucsd.edu
Vasily BulatovLawrence Livermore National LaboratoryVerified email at llnl.gov
Shiu Fai Frankie LiSr. Manager, MLVerified email at alumni.cmu.edu
justin warkProfessor of Physics, University of OxfordVerified email at physics.ox.ac.uk
Mark C. MessnerArgonne National LaboratoryVerified email at anl.gov

Mukul Kumar

Lawrence Livermore National Laboratory

Verified email at llnl.gov

Grain boundaries electron microscopy and diffraction methods shock physics metamaterials dynamic fragmentation


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Electron backscatter diffraction in materials science AJ Schwartz, M Kumar, BL Adams, DP Field Springer, 2009	2072	2009
An experimental investigation into additive manufacturing-induced residual stresses in 316L stainless steel AS Wu, DW Brown, M Kumar, GF Gallegos, WE King Metallurgical and Materials Transactions A 45 (13), 6260-6270, 2014	595	2014
Probing the active surface sites for CO reduction on oxide-derived copper electrocatalysts A Verdaguer-Casadevall, CW Li, TP Johansson, SB Scott, JT McKeown, ... Journal of the American Chemical Society 137 (31), 9808-9811, 2015	534	2015
Grain-boundary engineering markedly reduces susceptibility to intergranular hydrogen embrittlement in metallic materials S Bechtle, M Kumar, BP Somerday, ME Launey, RO Ritchie Acta materialia 57 (14), 4148-4157, 2009	419	2009
Analysis of grain boundary networks and their evolution during grain boundary engineering CA Schuh, M Kumar, WE King Acta Materialia 51 (3), 687-700, 2003	336	2003
Modifications to the microstructural topology in fcc materials through thermomechanical processing M Kumar, WE King, AJ Schwartz Acta Materialia 48 (9), 2081-2091, 2000	327	2000
Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials M Kumar, AJ Schwartz, WE King Acta materialia 50 (10), 2599-2612, 2002	283	2002
Grain boundary energy function for fcc metals VV Bulatov, BW Reed, M Kumar Acta Materialia 65, 161-175, 2014	240	2014
Analysis of local orientation gradients in deformed single crystals DP Field, PB Trivedi, SI Wright, M Kumar Ultramicroscopy 103 (1), 33-39, 2005	221	2005
Effect of microstructural length scales on spall behavior of copper RW Minich, JU Cazamias, M Kumar, AJ Schwartz Metallurgical and Materials Transactions A 35, 2663-2673, 2004	191	2004
High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering Y Gao, M Kumar, RK Nalla, RO Ritchie Metallurgical and Materials Transactions A 36 (12), 3325-3333, 2005	156	2005
Present state of electron backscatter diffraction and prospective developments RA Schwarzer, DP Field, BL Adams, M Kumar, AJ Schwartz Electron backscatter diffraction in materials science, 1-20, 2009	141	2009
Connectivity and percolation in simulated grain-boundary networks CA Schuh, RW Minich, M Kumar Philosophical Magazine 83 (6), 711-726, 2003	137	2003
Atomistic modeling of shock-induced void collapse in copper LP Davila, P Erhart, EM Bringa, MA Meyers, VA Lubarda, MS Schneider, ... Applied Physics Letters 86 (16), 161902, 2005	129	2005
Materials science under extreme conditions of pressure and strain rate BA Remington, G Bazan, J Belak, E Bringa, JD Colvin, MJ Edwards, ... Metallurgical and Materials Transactions A 35, 2587-2607, 2004	111	2004
High-cycle fatigue of nickel-base superalloy René 104 (ME3): Interaction of microstructurally small cracks with grain boundaries of known character Y Gao, JS Stölken, M Kumar, RO Ritchie Acta materialia 55 (9), 3155-3167, 2007	110	2007
Universal features of grain boundary networks in FCC materials CA Schuh, M Kumar, WE King Journal of materials science 40, 847-852, 2005	85	2005
Atomistic mechanism of shock-induced void collapse in nanoporous metals P Erhart, EM Bringa, M Kumar, K Albe Physical Review B 72 (5), 052104, 2005	80	2005
Mathematical methods for analyzing highly-twinned grain boundary networks BW Reed, M Kumar Scripta materialia 54 (6), 1029-1033, 2006	77	2006
The α→ ϵ phase transition in iron at strain rates up to∼ 109 s− 1 JC Crowhurst, BW Reed, MR Armstrong, HB Radousky, JA Carter, ... Journal of Applied Physics 115 (11), 113506, 2014	75	2014

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