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Joe L. Gonzalez
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Design, fabrication, and characterization of dense compressible microinterconnects
PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017
172017
Fiber-interconnect silicon chiplet technology for self-aligned fiber-to-chip assembly
C Wan, JL Gonzalez, T Fan, A Adibi, TK Gaylord, MS Bakir
IEEE Photonics Technology Letters 31 (16), 1311-1314, 2019
142019
Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs)
PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir
IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018
122018
Thermomechanical analysis and package-level optimization of mechanically flexible interconnects for interposer-on-motherboard assembly
MO Hossen, JL Gonzalez, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
82018
Microfabrication, coil characterization, and hermetic packaging of millimeter-sized free-floating neural probes
P Yeon, SK Rajan, J Falcone, JL Gonzalez, GS May, RV Bellamkonda, ...
IEEE Sensors Journal 21 (12), 13837-13848, 2021
72021
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes
P Yeon, JL Gonzalez, M Zia, SK Rajan, GS May, MS Bakir, M Ghovanloo
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
62017
3-D integrated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
62016
A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration
JL Gonzalez, SK Rajan, JR Brescia, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
52021
Polylithic integration of 2.5-D and 3-D chiplets enabled by multi-height and fine-pitch CMIs
PK Jo, SK Rajan, JL Gonzalez, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
52020
Flexible interconnect design using a mechanically-focused, multi-objective genetic algorithm
JL Gonzalez, PK Jo, R Abbaspour, MS Bakir
Journal of Microelectromechanical Systems 27 (4), 677-685, 2018
52018
Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems
PK Jo, M Zia, JL Gonzalez, MS Bakir
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017
52017
A microfabricated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ...
2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015
52015
Power conversion gain as a design metric for rfid systems
MJ Almada, L Blanca-Pimentel, JT Block, JL Gonzalez, CR Valenta, ...
Proceedings of the 2012 IEEE International Symposium on Antennas and …, 2012
52012
A disposable and self-aligned 3-D integrated bio-sensing interface module for CMOS cell-based biosensor applications
JL Gonzalez, PK Jo, R Abbaspour, MS Bakir
IEEE Electron Device Letters 39 (8), 1215-1218, 2018
42018
A die-level, replaceable integrated chiplet (PINCH) assembly using a socketed platform, compressible microinterconnects, and self-alignment
JL Gonzalez, JR Brescia, T Zheng, SK Rajan, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
32021
Fabrication of and cell growth on ‘silicon membranes’ with high density TSVs for bio-sensing applications
M Zia, C Zhang, P Thadesar, T Hookway, T Chi, J Gonzalez, T McDevitt, ...
2015 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2015
22015
Heterogeneous Integration of Chiplets Using Socketed Platforms, Off-Chip Flexible Interconnects, and Self-Alignment Technologies
JL Gonzalez
Georgia Institute of Technology, 2021
12021
Heterogeneous Multi-Die High-Density Interconnect Stitching
PK Jo, X Zhang, JL Gonzalez, MS Bakir, ...
2018
Power Conversion Gain as a Design Metric for RFID Systems
JT Block, L Blanca-Pimentel, JL Gonzalez, MJ Almada, CR Valenta, ...
IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM 1 (1), 523-524, 2012
2012
Advanced Packaging Technologies
M Langenmair, M Hofert, M Eickenscheidt, T Stieglitz, S Wang, Z Zhong, ...
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