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Peidong YangUCBVerified email at berkeley.edu- Li ShiUniversity of Texas at Austin, University of California at Berkeley, IBM ResearchVerified email at mail.utexas.edu
- Deyu LiVanderbilt UniversityVerified email at vanderbilt.edu
- Rachel SegalmanEdward Noble Kramer Professor of Materials, Dept. Chair of Chemical Engineering, UCSBVerified email at ucsb.edu
- Rohit KarnikProfessor of Mechanical Engineering, Massachusetts Institute of TechnologyVerified email at mit.edu
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Joshua M. O. ZideProfessor, Materials Science and Engineering, University of DelawareVerified email at udel.edu
- John BowersProfessor of Electrical and Computer Engineering, UCSBVerified email at ece.ucsb.edu
- Paul McEuenProfessor of Physics, Cornell UniversityVerified email at cornell.edu
- Renkun ChenProfessor, Mechanical and Aerospace Engineering, Materials Science and Engineering, UCSDVerified email at ucsd.edu
- Choongho YuProfessor, Texas A&M UniversityVerified email at tamu.edu
- Jayakanth RavichandranUniversity of Southern CaliforniaVerified email at usc.edu
- Chuanhua DuanAssociate Professor of Mechanical Engineering, Boston UniversityVerified email at bu.edu
- Steven ChuProf.Verified email at stanford.edu
- Pramod ReddyProfessor of Mechanical Engineering, University of MichiganVerified email at umich.edu
