| Stepwise design methodology and heterogeneous integration routine of air-cooled SiC inverter for electric vehicle Z Zeng, X Zhang, F Blaabjerg, H Chen, T Sun IEEE transactions on power electronics 35 (4), 3973-3988, 2019 | 53 | 2019 |
| Changes and challenges of photovoltaic inverter with silicon carbide device Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran Renewable and Sustainable Energy Reviews 78, 624-639, 2017 | 50 | 2017 |
| Design and optimization of SiC MOSFET wire bondless power modules H Chen, MM Hossain, DG Castillo, X Li, A Wallace, Y Chen, HA Mantooth 2020 IEEE 9th international power electronics and motion control conference …, 2020 | 29 | 2020 |
| High voltage sic power module optimized for low parasitics and compatible system interface X Li, Y Chen, Y Wu, H Chen, W Weber, A Nasiri, R Cuzner, Y Zhao, ... 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 999-1003, 2022 | 19 | 2022 |
| Analyses and experiments of the Schottky contact super barrier rectifier (SSBR) W Chen, R Liao, Z Zeng, P Zhang, Y Zhong, K Tan, H Chen, B Zhang IEEE Electron Device Letters 38 (7), 902-905, 2017 | 18 | 2017 |
| Feasibility design of tight integration of low inductance sic power module with microchannel cooler H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022 | 16 | 2022 |
| SiC 器件在光伏逆变器中的应用与挑战 曾正， 邵伟华， 胡博容， 陈昊， 廖兴林， 陈文锁， 李辉， 冉立 中国电机工程学报 37 (1), 221-232, 2017 | 14 | 2017 |
| Emi mitigation with stacking dbc substrate for high voltage power module X Li, Y Chen, H Chen, S Chinnaiyan, T Li, R Cuzner, A Nasiri, A Mantooth, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022 | 11 | 2022 |
| On-off behavior control of SiC MOSFET by gate drive loops Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran, Y Zhang, Q Qiu | 11 | 2018 |
| Comparative evaluations and failure modes of wire-bonding packaged sic, si, and hybrid power modules X Li, Z Zeng, H Chen, W Shao, L Ran 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018 | 10 | 2018 |
| 基于栅极驱动回路的 SiC MOSFET 开关行为调控 曾正， 邵伟华， 陈昊， 胡博容， 陈文锁， 李辉， 冉立， 张瑜洁， 秋琪 中国电机工程学报 38 (4), 1165-1176, 2018 | 7 | 2018 |
| A 10 kv sic power module stacked substrate design with patterned middle-layer for partial discharge reduction X Li, H Chen, R Paul, S Mukherjee, X Du, R Cuzner, X Song, Y Zhao, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 344-349, 2023 | 6 | 2023 |
| Multi-level embedded three-dimensional manifold microchannel heat sink of aluminum nitride direct bonded copper for the high-power electronic module Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging 146 (1), 011006, 2024 | 5 | 2024 |
| Electro-thermal limited switching frequency for parallel diodes X Li, H Jiang, B Hu, H Chen, Z Zeng, L Ran, P Mawby 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4692-4698, 2018 | 5 | 2018 |
| 3.3 kV Low-Inductance Full SiC Power Module Y Chen, X Du, L Du, X Du, ASMK Hasan, X Li, H Chen, R Paul, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2634-2640, 2023 | 4 | 2023 |
| SiC, Si, 混合功率模块封装对比评估与失效分析 李晓玲， 曾正， 陈昊， 邵伟华， 胡博容， 冉立 中国电机工程学报 38 (16), 4823-4835, 2018 | 4 | 2018 |
| A Novel Integrated 1.2 kV Double-sided Cooled Power Module R Paul, R Alizadeh, H Chen, X Li, Y Chen, HA Mantooth 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 372-377, 2023 | 2 | 2023 |
| Demonstration of wire bondless silicon carbide power module with integrated LTCC jet impingement cooler H Chen, T Wei, X Li, Y Chen, Y Lin, S Chinnaiyan, M Asheghi, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2022 | 2 | 2022 |
| SiC MOSFET 短路特性评估及其温度依赖性模型 邵伟华， 冉立， 曾正， 李晓玲， 侯旭， 陈昊， 李辉 中国电机工程学报 38 (7), 2121-2131, 2018 | 2 | 2018 |
| Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging 146 (2), 2024 | 1 | 2024 |
Homer Alan MantoothUniversity of ArkansasVerified email at uark.edu
