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Co-authors
- Costas GrigoropoulosProfessor of Mechanical Engineering, University of California, BerkeleyVerified email at berkeley.edu
- Manish K. TiwariUniversity College LondonVerified email at ucl.ac.uk
- Vartan KurtcuogluAssociate Professor, University of ZurichVerified email at uzh.ch
- Bruno MichelIBM - Research - Zurich, Advanced Thermal PackagingVerified email at zurich.ibm.com
- Thomas M. SchutziusAssistant Professor, UC BerkeleyVerified email at berkeley.edu
- Chander Shekhar SharmaIndian Institute of Technology RoparVerified email at iitrpr.ac.in
- Patrick GallikerETH ZurichVerified email at ethz.ch
- Nico HotzVerified email at duke.edu
- Brian R. BurgWyss Zurich, ETH ZurichVerified email at ethz.ch
- Carlo AntoniniScientist, Department of Materials Science, University of Milano-BicoccaVerified email at unimib.it
- Constantine M. MegaridisMechanical and Industrial Engineering, U Illinois ChicagoVerified email at uic.edu
- David J. NorrisETH ZurichVerified email at ethz.ch
- Julian MarschewskiLaboratory of Thermodynamics in Emerging Technologies, ETH ZurichVerified email at ltnt.iet.mavt.ethz.ch
- Evangelos BoutsianisThenamarisVerified email at thenamaris.com
- Ufuk OlgacNovartis Biomedical ResearchVerified email at novartis.com
- Paul SummersHead of MRI - SFU ImageTech Lab: Researcher - IEO Istituto Europeo di Oncologia IRCCSVerified email at sfu.ca
- Jean FrechetUniversity of California, BerkeleyVerified email at berkeley.edu
- Francesco RobottiHylomorph, ETH ZürichVerified email at ethz.ch
- Ludwig J. GaucklerETH ZürichVerified email at mat.ethz.ch
- David K. KimMIT Lincoln LaboratoryVerified email at ll.mit.edu