| High-performance near-infrared photodetector based on nano-layered MoSe2 PJ Ko, A Abderrahmane, NH Kim, A Sandhu Semiconductor Science and Technology 32 (6), 065015, 2017 | 59 | 2017 |
| Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions NH Kim, YJ Seo, WS Lee Microelectronic Engineering 83 (2), 362-370, 2006 | 59 | 2006 |
| Thickness dependence on the optoelectronic properties of multilayered GaSe based photodetector PJ Ko, A Abderrahmane, T Takamura, NH Kim, A Sandhu Nanotechnology 27 (32), 325202, 2016 | 50 | 2016 |
| Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process NH Kim, MH Choi, SY Kim, EG Chang Microelectronic Engineering 83 (3), 506-512, 2006 | 49 | 2006 |
| Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions Y Kwon, NH Kim, GP Choi, WS Lee, YJ Seo, J Park Microelectronic Engineering 82 (3-4), 314-320, 2005 | 49 | 2005 |
| Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP NH Kim, JH Lim, SY Kim, EG Chang Materials letters 57 (29), 4601-4604, 2003 | 49 | 2003 |
| Electrical and optical properties of sputter-deposited cadmium sulfide thin films optimized by annealing temperature NH Kim, SH Ryu, HS Noh, WS Lee Materials science in semiconductor processing 15 (2), 125-130, 2012 | 48 | 2012 |
| Influences of thickness-uniformity and surface morphology on the electrical and optical properties of sputtered CdTe thin films for large-area II–VI semiconductor … YO Choi, NH Kim, JS Park, WS Lee Materials Science and Engineering: B 171 (1-3), 73-78, 2010 | 40 | 2010 |
| Isothermal aging characteristics of Sn–Pb micro solder bumps KS Kim, CH Yu, NH Kim, NK Kim, HJ Chang, EG Chang Microelectronics Reliability 43 (5), 757-763, 2003 | 39 | 2003 |
| Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate YJ Seo, NH Kim, WS Lee Materials Letters 60 (9-10), 1192-1197, 2006 | 37 | 2006 |
| Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning NH Kim, PJ Ko, GW Choi, YJ Seo, WS Lee Thin Solid Films 504 (1-2), 166-169, 2006 | 34 | 2006 |
| Effect of nonionic surfactants on the stability of alumina slurry for Cu CMP DW Lee, NH Kim, EG Chang Materials Science and Engineering: B 118 (1-3), 293-300, 2005 | 27 | 2005 |
| CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters GW Choi, KY Lee, NH Kim, JS Park, YJ Seo, WS Lee Microelectronic engineering 83 (11-12), 2213-2217, 2006 | 25 | 2006 |
| Characteristics of plasma-enhanced atomic-layer deposited (PEALD) SnO {sub 2} thin films W Lee, Y Choi, K Hong, N Kim, Y Park, J Park Journal of the Korean Physical Society 46, 2005 | 24 | 2005 |
| Gate-tunable optoelectronic properties of a nano-layered GaSe photodetector A Abderrahmane, PG Jung, NH Kim, PJ Ko, A Sandhu Optical Materials Express 7 (2), 587-592, 2017 | 23 | 2017 |
| A pilot investigation on laser annealing for thin-film solar cells: Crystallinity and optical properties of laser-annealed CdTe thin films by using an 808-nm diode laser NH Kim, CI Park, J Park Journal of the Korean Physical Society 62, 502-507, 2013 | 23 | 2013 |
| Non-selenization method using sputtering deposition with a CuSe2 target for CIGS thin film NH Kim, S Oh, WS Lee Journal of the Korean Physical Society 61, 1177-1180, 2012 | 21 | 2012 |
| Electrical and thermal properties of platinum thin films prepared by DC magnetron sputtering for micro-heater of microsensor applications after CMP process NH Kim, DM Na, PJ Ko, JS Park, WS Lee Solid State Phenomena 124, 267-270, 2007 | 21 | 2007 |
| Fabrication of Si-based two-dimensional photonic quasicrystals by using multiple-exposure holographic lithography JB Yeo, SD Yun, NH Kim, HY Lee Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2009 | 19 | 2009 |
| Improvement of TEOS-chemical mechanical polishing performance by control of slurry temperature NH Kim, PJ Ko, YJ Seo, WS Lee Microelectronic engineering 83 (2), 286-292, 2006 | 18 | 2006 |
Jongheun JH LimIntelVerified email at intel.com
