| 3D microfluidic gradient generator for combination antimicrobial susceptibility testing E Sweet, B Yang, J Chen, R Vickerman, Y Lin, A Long, E Jacobs, T Wu, ... Microsystems & nanoengineering 6 (1), 92, 2020 | 32 | 2020 |
| Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers T Wei, S Hazra, Y Lin, MP Gupta, M Degner, M Asheghi, KE Goodson Journal of Electronic Packaging 145 (2), 021008, 2023 | 13 | 2023 |
| Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling S Hazra, T Wei, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner International Journal of Heat and Mass Transfer 197, 123356, 2022 | 12 | 2022 |
| Optimized thermal management of a battery energy-storage system (BESS) inspired by air-cooling inefficiency factor of data centers Y Lin, YW Chen, JT Yang International Journal of Heat and Mass Transfer 200, 123388, 2023 | 10 | 2023 |
| Multi-level embedded three-dimensional manifold microchannel heat sink of aluminum nitride direct bonded copper for the high-power electronic module Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging 146 (1), 011006, 2024 | 5 | 2024 |
| Demonstration of wire bondless silicon carbide power module with integrated LTCC jet impingement cooler H Chen, T Wei, X Li, Y Chen, Y Lin, S Chinnaiyan, M Asheghi, ... 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-6, 2022 | 2 | 2022 |
| Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging 146 (2), 2024 | 1 | 2024 |
| Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ... Journal of Electronic Packaging, 1-45, 2024 | 1 | 2024 |
| Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler H Chen, Y Lin, T Wei, X Li, R Paul, R Whitt, X Song, Y Zhao, M Asheghi, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 366-371, 2023 | 1 | 2023 |
| Development of a Hybrid Capillary-driven Single-phase and Two-phase Micro-cooler for Power Electronics Cooling Y Lin, H Kwon, H Chen, MP Gupta, M Degner, M Asheghi, HA Mantooth, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites H Qiao, K Jiang, T Wei, Y Lin, C Perez, M Asheghi, K Goodson International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| The Capillary-driven Two-phase Embedded Microchannel Heatsink for the Efficient Cooling of Power Electronic Modules Y Lin, T Wei, M Asheghi, K Goodson APS March Meeting Abstracts 2023, N00. 262, 2023 | | 2023 |
