| Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications MJ Yim, KW Paik International journal of adhesion and adhesives 26 (5), 304-313, 2006 | 225 | 2006 |
| Design and understanding of anisotropic conductive films (ACFs) for LCD packaging MJ Yim, KW Paik Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997 | 212 | 1997 |
| Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging MJ Yim, Y Li, K Moon, KW Paik, CP Wong Journal of adhesion science and technology 22 (14), 1593-1630, 2008 | 198 | 2008 |
| The contact resistance and reliability of anisotropically conductive film (ACF) MJ Yim, KW Paik IEEE transactions on advanced packaging 22 (2), 166-173, 1999 | 143 | 1999 |
| Studies of the mechanical and electrical properties of lead-free solder joints SK Kang, WK Choi, MJ Yim, DY Shih Journal of Electronic Materials 31, 1292-1303, 2002 | 116 | 2002 |
| Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate MJ Yim, KW Paik US Patent 6,238,597, 2001 | 115 | 2001 |
| Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications MJ Yim, J Hwang, KW Paik Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 105 | 2005 |
| Interfacial reaction studies on lead (Pb)-free solder alloys SK Kang, DY Shih, K Fogel, P Lauro, MJ Yim, GG Advocate, M Griffin, ... IEEE Transactions on Electronics Packaging Manufacturing 25 (3), 155-161, 2002 | 89 | 2002 |
| Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives MJ Yim, Y Li, KS Moon, CP Wong Journal of electronic materials 36, 1341-1347, 2007 | 64 | 2007 |
| Highly reliable non-conductive adhesives for flip chip CSP applications MJ Yim, JS Hwang, W Kwon, KW Jang, KW Paik IEEE transactions on electronics packaging manufacturing 26 (2), 150-155, 2003 | 54 | 2003 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates MJ Yim, KW Paik IEEE transactions on components and packaging technologies 24 (1), 24-32, 2001 | 54 | 2001 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications MJ Yim, W Ryu, YD Jeon, J Lee, S Ahn, J Kim, KW Paik IEEE Transactions on Components and Packaging Technologies 22 (4), 575-581, 1999 | 51 | 1999 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation WS Kwon, MJ Yim, KW Paik, SJ Ham, SB Lee J. Electron. Packag. 127 (2), 86-90, 2005 | 50 | 2005 |
| Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive MJ Yim, KW Baik US Patent 6,518,097, 2003 | 41 | 2003 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film MJ Yim, JS Hwang, JG Kim, JY Ahn, HJ Kim, W Kwon, KW Paik Journal of electronic materials 33, 76-82, 2004 | 39 | 2004 |
| Review of electrically conductive adhesive technologies for electronic packaging MJ Yim, KW Paik Electron. Mater. Lett 2 (3), 183-194, 2006 | 38 | 2006 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications MJ Yim, IH Jeong, HK Choi, JS Hwang, JY Ahn, W Kwon, KW Paik IEEE Transactions on Components and Packaging Technologies 28 (4), 789-796, 2005 | 38 | 2005 |
| Void formation study of flip chip in package using no-flow underfill S Lee, MJ Yim, RN Master, CP Wong, DF Baldwin IEEE Transactions on electronics packaging manufacturing 31 (4), 297-305, 2008 | 37 | 2008 |
| Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method KW Paik, JW Nah, YD Jeon, MJ Yim US Patent 6,362,090, 2002 | 37 | 2002 |
| Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film MJ Yim, YD Jeon, KW Paik IEEE Transactions on Electronics Packaging Manufacturing 23 (3), 171-176, 2000 | 37 | 2000 |
