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Co-authors
- Yong Duk HanResearch Specialist, University of Illinois at ChicagoVerified email at uic.edu
- Hyeong Jin ChunAjou Univ.Verified email at ajou.ac.kr
- Yoomin ParkAjou UniversityVerified email at ajou.ac.kr
- Dae-Sik LeeETRIVerified email at etri.re.kr
- Ka Ram KimGeorgia Institute of TechnologyVerified email at gatech.edu
- Hyeon-Bong PyoETRIVerified email at etri.re.kr
- Haesik YangPusan National UniversityVerified email at pusan.ac.kr
- Sang Jun SimKorea UniversityVerified email at korea.ac.kr
- Dohoon LeeKorea Institute of Industrial TechnologyVerified email at kitech.re.kr
- Kangil KimKorea Institute of Fusion EnergyVerified email at kfe.re.kr
- Sung-Jin KimMechanical Engineering Department in Konkuk UniversityVerified email at konkuk.ac.kr
- Eunkeu Oh (오은규)Naval Research LaboratoryVerified email at nrl.navy.mil
- Hyunjin Yoon아주대Verified email at ajou.ac.kr
- DONG WOO KIMMolecular science & technology, Ajou. univ.Verified email at ajou.ac.kr
- Kook-Nyung LeeIVD Device Research Institute, Wizbiosolutions Inc.Verified email at wizbiosolution.com
- Cuong CaoReader at Queen's University BelfastVerified email at qub.ac.uk
- Hyun Gyu ParkProfessor of Chemical and biomolecular engineering, Korea Advanced Institute of Science andVerified email at kaist.ac.kr
- Min-Gon KimGwangju Institute of Science and TechnologyVerified email at gist.ac.kr
- Sinwook ParkTechnion I.I.TVerified email at technion.ac.il
- Richard YongQing FuProfessor in Northumbria University at Newcastle, UKVerified email at northumbria.ac.uk