Zhiheng Huang
Zhiheng Huang
Sun Yat-sen University, Loughborough University, Harbin Institute of Technology
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Proton exchange membranes for high temperature proton exchange membrane fuel cells: Challenges and perspectives
E Qu, X Hao, M Xiao, D Han, S Huang, Z Huang, S Wang, Y Meng
Journal of power sources 533, 231386, 2022
A new sintering additive for silicon carbide ceramic
ZH Huang, DC Jia, Y Zhou, YG Liu
Ceramics International 29 (1), 13-17, 2003
Reliability issues in Pb-free solder joint miniaturization
Z Huang, PP Conway, E Jung, RC Thomson, C Liu, T Loeher, M Minkus
Journal of electronic materials 35, 1761-1772, 2006
A computational interface for thermodynamic calculations software MTDATA
Z Huang, PP Conway, RC Thomson, AT Dinsdale, JAJ Robinson
Calphad 32 (1), 129-134, 2008
Microstructural considerations for ultrafine lead free solder joints
Z Huang, PP Conway, RC Thomson
Microelectronics Reliability 47 (12), 1997-2006, 2007
Effect of a new additive on mechanical properties of hot-pressed silicon carbide ceramics
ZH Huang, DC Jia, Y Zhou, YJ Wang
Materials research bulletin 37 (5), 933-940, 2002
Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior
Z Wu, Z Huang, Y Ma, H Xiong, PP Conway
Electronic Materials Letters 10, 281-292, 2014
Effect of solder bump geometry on the microstructure of Sn–3.5 wt% Ag on electroless nickel immersion gold during solder dipping
Z Huang, PP Conway, C Liu, RC Thomson
Journal of materials research 20 (3), 649-658, 2005
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys
C Liu, Z Huang, PP Conway, RC Thomson
Journal of materials science 42, 4076-4086, 2007
The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints
Z Huang, PP Conway, C Liu, RC Thomson
Journal of electronic materials 33, 1227-1235, 2004
A generalized computational interface for combined thermodynamic and kinetic modeling
H Xiong, Z Huang, Z Wu, PP Conway
Calphad 35 (3), 391-395, 2011
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Z Huang, PP Conway, R Qin
Microsystem technologies 15, 101-107, 2009
A rechargeable Li–CO 2 battery based on the preservation of dimethyl sulfoxide
Z Lu, M Xiao, S Wang, D Han, Z Huang, S Huang, Y Meng
Journal of Materials Chemistry A 10 (26), 13821-13828, 2022
Investigation on a magnesiothermic reduction process for preparation of nanocrystalline silicon thin film
B Ma, Z Huang, L Mei, M Fang, Y Liu, X Wu
Surface Engineering 32 (10), 761-765, 2016
Effects of stress and electromigration on microstructural evolution in microbumps of three-dimensional integrated circuits
H Xiong, Z Huang, P Conway
IEEE Transactions on Device and Materials Reliability 14 (4), 995-1004, 2014
Preparation of LiTaO3 nanoparticles by a sol–gel route
YG Liu, JH Hu, ZH Huang, MH Fang
Journal of sol-gel science and technology 58, 664-668, 2011
Characterisation of intermetallics and mechanical behaviour in the reaction between SnAgCu and Sn-Pb solder alloys
Z Huang, C Liu, P Conway, R Thomson
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004
In situ TEM observation of crack propagation in LiTaO3 particle toughened Al2O3 ceramics
YG Liu, DC Jia, Y Zhou, MH Fang, ZH Huang
Ceramics International 37 (2), 647-650, 2011
A stable anode-free Na-S full cell at room temperature
M Geng, D Han, Z Huang, S Wang, M Xiao, S Zhang, L Sun, S Huang, ...
Energy Storage Materials 52, 230-237, 2022
Polybenzimidazole confined in semi-interpenetrating networks of crosslinked poly (arylene ether ketone) for high temperature proton exchange membrane
E Qu, J Jiang, M Xiao, D Han, S Huang, Z Huang, S Wang, Y Meng
Nanomaterials 12 (5), 773, 2022
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Articles 1–20