| Computing thermomechanical properties of crosslinked epoxy by molecular dynamic simulations S Yang, J Qu Polymer 53 (21), 4806-4817, 2012 | 259 | 2012 |
| A coarse-grained model for epoxy molding compound S Yang, Z Cui, J Qu The Journal of Physical Chemistry B 118 (6), 1660-1669, 2014 | 75 | 2014 |
| A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate S Yang, F Gao, J Qu Polymer 54 (18), 5064-5074, 2013 | 68 | 2013 |
| Coarse-grained molecular dynamics simulations of the tensile behavior of a thermosetting polymer S Yang, J Qu Physical Review E 90 (1), 012601, 2014 | 49 | 2014 |
| An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations S Yang, J Qu Modelling and Simulation in Materials Science and Engineering 22, 065011, 2014 | 17 | 2014 |
| A study of highly crosslinked Epoxy Molding Compound and its interface with copper substrate by molecular dynamic simulations S Yang, F Gao, J Qu 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 13 | 2010 |
| Advances in delamination modeling of metal/polymer systems: atomistic aspects O Van Der Sluis, N Iwamoto, J Qu, S Yang, C Yuan, WD Van Driel, ... Nanopackaging: nanotechnologies and electronics packaging, 129-183, 2018 | 4 | 2018 |
| Modeling of separation behavior of epoxy/Cu interface using molecular dynamics simulation S Yang, F Gao, J Qu 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1110-1114, 2011 | 3 | 2011 |
| Multi-scale Modeling of Polymer/Metal Interface S Yang Northwestern University, 2014 | | 2014 |
