Shaorui Yang
Cited by
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Computing thermomechanical properties of crosslinked epoxy by molecular dynamic simulations
S Yang, J Qu
Polymer 53 (21), 4806-4817, 2012
A coarse-grained model for epoxy molding compound
S Yang, Z Cui, J Qu
The Journal of Physical Chemistry B 118 (6), 1660-1669, 2014
A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate
S Yang, F Gao, J Qu
Polymer 54 (18), 5064-5074, 2013
Coarse-grained molecular dynamics simulations of the tensile behavior of a thermosetting polymer
S Yang, J Qu
Physical Review E 90 (1), 012601, 2014
An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations
S Yang, J Qu
Modelling and Simulation in Materials Science and Engineering 22, 065011, 2014
A study of highly crosslinked Epoxy Molding Compound and its interface with copper substrate by molecular dynamic simulations
S Yang, F Gao, J Qu
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
Advances in delamination modeling of metal/polymer systems: atomistic aspects
O Van Der Sluis, N Iwamoto, J Qu, S Yang, C Yuan, WD Van Driel, ...
Nanopackaging: nanotechnologies and electronics packaging, 129-183, 2018
Modeling of separation behavior of epoxy/Cu interface using molecular dynamics simulation
S Yang, F Gao, J Qu
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1110-1114, 2011
Multi-scale Modeling of Polymer/Metal Interface
S Yang
Northwestern University, 2014
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