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Christopher Jahnes
Christopher Jahnes
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Title
Cited by
Cited by
Year
Microstructured magnetic tunnel junctions
WJ Gallagher, SSP Parkin, Y Lu, XP Bian, A Marley, KP Roche, ...
Journal of Applied Physics 81 (8), 3741-3746, 1997
5831997
Hydrogenated oxidized silicon carbon material
A Grill, CV Jahnes, VV Patel, LC Perraud
US Patent 6,147,009, 2000
5052000
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
LP Buchwalter, AC Callegari, SA Cohen, TO Graham, JP Hummel, ...
US Patent 6,184,121, 2001
2892001
Production of electroless Co (P) with designed coercivity
M Paunovic, C Jahnes
US Patent 6,197,364, 2001
2732001
Dual damascene processing for semiconductor chip interconnects
A Grill, JP Hummel, CV Jahnes, VV Patel, KL Saenger
US Patent 6,140,226, 2000
2582000
Non-blocking 4x4 electro-optic silicon switch for on-chip photonic networks
M Yang, WMJ Green, S Assefa, J Van Campenhout, BG Lee, CV Jahnes, ...
Optics express 19 (1), 47-54, 2011
2262011
Integrated circuit inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,884,990, 1999
2171999
Integrated circuit toroidal inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 5,793,272, 1998
2001998
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
LP Buchwalter, KK Chan, TJ Dalton, CV Jahnes, JL Lund, KS Petrarca, ...
US Patent 7,943,412, 2011
1802011
On the pitting resistance of sputter‐deposited aluminum alloys
GS Frankel, RC Newman, CV Jahnes, MA Russak
Journal of the Electrochemical Society 140 (8), 2192, 1993
1771993
Integrated circuit spiral inductor
JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh
US Patent 6,114,937, 2000
1712000
The respective role of oxygen and water vapor on the tribology of hydrogenated diamond-like carbon coatings
C Donnet, TL Mogne, L Ponsonnet, M Belin, A Grill, V Patel, C Jahnes
Tribology Letters 4 (3), 259-265, 1998
1671998
Multilayer interconnect structure containing air gaps and method for making
KE Babich, RA Carruthers, TJ Dalton, A Grill, JC Hedrick, CV Jahnes, ...
US Patent 6,815,329, 2004
1662004
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,413,852, 2002
1642002
Methods for fabricating contacts to pillar structures in integrated circuits
S Assefa, G Costrini, CV Jahnes, MJ Rooks, JZ Sun
US Patent 8,008,095, 2011
1372011
2.5 D and 3D technology challenges and test vehicle demonstrations
JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1068-1076, 2012
1212012
Multilevel interconnect structure containing air gaps and method for making
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,737,725, 2004
1192004
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale
EG Colgan, BK Furman, CV Jahnes
US Patent 7,344,907, 2008
1172008
Pitting of sputtered aluminum alloy thin films
GS Frankel, MA Russak, CV Jahnes, M Mirzamaani, VA Brusic
1171989
Terabit/sec VCSEL-based 48-channel optical module based on holey CMOS transceiver IC
FE Doany, BG Lee, DM Kuchta, AV Rylyakov, C Baks, C Jahnes, F Libsch, ...
Journal of lightwave technology 31 (4), 672-680, 2013
1112013
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