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Fei Hui
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Recommended methods to study resistive switching devices
M Lanza, HSP Wong, E Pop, D Ielmini, D Strukov, BC Regan, L Larcher, ...
Advanced Electronic Materials 5 (1), 1800143, 2019
5692019
Electronic synapses made of layered two-dimensional materials
Y Shi, X Liang, B Yuan, V Chen, H Li, F Hui, Z Yu, F Yuan, E Pop, ...
Nature Electronics 1 (8), 458-465, 2018
5352018
Coexistence of grain‐boundaries‐assisted bipolar and threshold resistive switching in multilayer hexagonal boron nitride
C Pan, Y Ji, N Xiao, F Hui, K Tang, Y Guo, X Xie, FM Puglisi, L Larcher, ...
Advanced functional materials 27 (10), 1604811, 2017
2962017
Wafer-scale integration of two-dimensional materials in high-density memristive crossbar arrays for artificial neural networks
S Chen, MR Mahmoodi, Y Shi, C Mahata, B Yuan, X Liang, C Wen, F Hui, ...
Nature Electronics 3 (10), 638-645, 2020
2582020
Dopant‐free spiro‐triphenylamine/fluorene as hole‐transporting material for perovskite solar cells with enhanced efficiency and stability
YK Wang, ZC Yuan, GZ Shi, YX Li, Q Li, F Hui, BQ Sun, ZQ Jiang, LS Liao
Advanced Functional Materials 26 (9), 1375-1381, 2016
2552016
Graphene and related materials for resistive random access memories
F Hui, E Grustan‐Gutierrez, S Long, Q Liu, AK Ott, AC Ferrari, M Lanza
Advanced Electronic Materials 3 (8), 1600195, 2017
2042017
A Review on Dielectric Breakdown in Thin Dielectrics: Silicon Dioxide, High‐k, and Layered Dielectrics
F Palumbo, C Wen, S Lombardo, S Pazos, F Aguirre, M Eizenberg, F Hui, ...
Advanced Functional Materials 30 (18), 1900657, 2020
1632020
A review on principles and applications of scanning thermal microscopy (SThM)
Y Zhang, W Zhu, F Hui, M Lanza, T Borca‐Tasciuc, M Muñoz Rojo
Advanced functional materials 30 (18), 1900892, 2020
1452020
Nanoscale characterization of PM2.5 airborne pollutants reveals high adhesiveness and aggregation capability of soot particles
Y Shi, Y Ji, H Sun, F Hui, J Hu, Y Wu, J Fang, H Lin, J Wang, H Duan, ...
Scientific reports 5 (1), 11232, 2015
1292015
Boron nitride as two dimensional dielectric: Reliability and dielectric breakdown
Y Ji, C Pan, M Zhang, S Long, X Lian, F Miao, F Hui, Y Shi, L Larcher, ...
Applied Physics Letters 108 (1), 2016
1182016
On the use of two dimensional hexagonal boron nitride as dielectric
F Hui, C Pan, Y Shi, Y Ji, E Grustan-Gutierrez, M Lanza
Microelectronic Engineering 163, 119-133, 2016
1052016
Scanning probe microscopy for advanced nanoelectronics
F Hui, M Lanza
Nature electronics 2 (6), 221-229, 2019
992019
Resistive Random Access Memory Cells with a Bilayer TiO2/SiOX Insulating Stack for Simultaneous Filamentary and Distributed Resistive Switching
N Xiao, MA Villena, B Yuan, S Chen, B Wang, M Eliáš, Y Shi, F Hui, X Jing, ...
Advanced Functional Materials 27 (33), 1700384, 2017
852017
A review on the use of graphene as a protective coating against corrosion
J Hu, Y Ji, Y Shi, F Hui, H Duan, M Lanza
Ann. J. Mater. Sci. Eng 1, 16, 2014
832014
Advanced Data Encryption using 2D Materials
C Wen, X Li, T Zanotti, FM Puglisi, Y Shi, F Saiz, A Antidormi, S Roche, ...
Advanced Materials 33 (27), 2100185, 2021
732021
Graphene–boron nitride–graphene cross-point memristors with three stable resistive states
K Zhu, X Liang, B Yuan, MA Villena, C Wen, T Wang, S Chen, F Hui, Y Shi, ...
ACS applied materials & interfaces 11 (41), 37999-38005, 2019
662019
2D h-BN based RRAM devices
FM Puglisi, L Larcher, C Pan, N Xiao, Y Shi, F Hui, M Lanza
2016 IEEE International Electron Devices Meeting (IEDM), 34.8. 1-34.8. 4, 2016
652016
Model for multi-filamentary conduction in graphene/hexagonal-boron-nitride/graphene based resistive switching devices
C Pan, E Miranda, MA Villena, N Xiao, X Jing, X Xie, T Wu, F Hui, Y Shi, ...
2D Materials 4 (2), 025099, 2017
642017
Inkjet printed circuits with 2D semiconductor inks for high‐performance electronics
T Carey, A Arbab, L Anzi, H Bristow, F Hui, S Bohm, G Wyatt‐Moon, ...
Advanced Electronic Materials 7 (7), 2100112, 2021
562021
Distinguishing Oxygen Vacancy Electromigration and Conductive Filament Formation in TiO2 Resistance Switching Using Liquid Electrolyte Contacts
K Tang, AC Meng, F Hui, Y Shi, T Petach, C Hitzman, AL Koh, ...
Nano Letters 17 (7), 4390-4399, 2017
562017
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