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Muneeb Zia
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Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration
X Zhang, PK Jo, M Zia, GS May, MS Bakir
IEEE Electron Device Letters 38 (2), 255-257, 2016
232016
Design, fabrication, and characterization of dense compressible microinterconnects
PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017
172017
Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs
Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015
152015
Myomatrix arrays for high-definition muscle recording
B Chung, M Zia, KA Thomas, JA Michaels, A Jacob, A Pack, MJ Williams, ...
Elife 12, RP88551, 2023
132023
Flexible Multielectrode Arrays With 2-D and 3-D Contacts for Electromyography Recording
M Zia, B Chung, S Sober, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
112020
Fabrication and characterization of 3D multi-electrode array on flexible substrate for in vivo EMG recording from expiratory muscle of songbird
M Zia, B Chung, SJ Sober, MS Bakir
2018 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2018
112018
Chip-to-chip interconnect integration technologies
M Zia, C Zhang, HS Yang, L Zheng, M Bakir
IEICE Electronics Express 13 (6), 20162001-20162001, 2016
102016
A memory-based logic block with optimized-for-read SRAM for energy-efficient reconfigurable computing fabric
W Yueh, S Chatterjee, M Zia, S Bhunia, S Mukhopadhyay
IEEE Transactions on Circuits and Systems II: Express Briefs 62 (6), 593-597, 2015
92015
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes
P Yeon, JL Gonzalez, M Zia, SK Rajan, GS May, MS Bakir, M Ghovanloo
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
62017
Electrical and photonic off-chip interconnection and system integration
M Zia, C Wan, Y Zhang, M Bakir
Optical Interconnects for Data Centers, 265-286, 2017
62017
3-D integrated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016
62016
Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge
HS Yang, C Zhang, M Zia, L Zheng, MS Bakir
2014 Optical Interconnects Conference, 71-72, 2014
62014
High-performance flexible microelectrode array with PEDOT: PSS coated 3D micro-cones for electromyographic recording
J Lu, M Zia, MJ Williams, AL Jacob, B Chung, SJ Sober, MS Bakir
2022 44th Annual International Conference of the IEEE Engineering in …, 2022
52022
Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems
PK Jo, M Zia, JL Gonzalez, MS Bakir
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017
52017
A microfabricated electronic microplate platform for low-cost repeatable biosensing applications
M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ...
2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015
52015
Cascaded Ni hard mask to create chlorine-based ICP dry etched deep mesas for high-power devices
H Ahmad, Z Engel, M Zia, AS Weidenbach, CM Matthews, B Zivasatienraj, ...
Semiconductor Science and Technology 36 (12), 125016, 2021
42021
Post-CMOS fabrication technology enabling simultaneous fabrication of 3-D solenoidal micro-inductors and flexible I/Os
M Zia, H Oh, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
42018
Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects
C Zhang, P Thadesar, M Zia, T Sarvey, MS Bakir
2014 International 3D Systems Integration Conference (3DIC), 1-4, 2014
42014
Fabrication of and cell growth on ‘silicon membranes’ with high density TSVs for bio-sensing applications
M Zia, C Zhang, P Thadesar, T Hookway, T Chi, J Gonzalez, T McDevitt, ...
2015 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2015
22015
„RoboCupRescue 2009-Robot League Team< SAVIOUR (Pakistan)>‟
W Inam, M Zia, N Shayeq, K Umar, K Aziz, M Fahd, G Ishaq
Institute of Engineering Science and Technology, Swabi, Pakistan, 0
2
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