Get my own profile
Public access
View all22 articles
3 articles
available
not available
Based on funding mandates
Co-authors
Robert KlieUniversity of Illinois at ChicagoVerified email at uic.edu
Michael J. MillsThe Ohio State UniversityVerified email at osu.edu
Roberto C. MyersProfessor of Materials Science, Electrical Engineering, and Physics, The Ohio State UniversityVerified email at osu.edu
Santino CarnevaleIBM T.J. Watson Research CenterVerified email at ibm.com
Dr. Bijandra KumarAssociate ProfessorVerified email at ecsu.edu
Amirhossein BehranginiaUniversity of illinois at ChicagoVerified email at uic.edu
Chunjoong KimAssistant Professor, Department of Materials Science and Engineering, Chungnam National UniversityVerified email at cnu.ac.kr
Cong LiuStaff Scientist, Argonne National LaboratoryVerified email at anl.gov
Richard T. HaaschMaterials Research Laboratory, University of IllinoisVerified email at illinois.edu
Jeremiah AbiadeUniversity of Illinois at ChicagoVerified email at uic.edu
Jordi CabanaJoint Appointment, University of Illinois Chicago and Argonne National LaboratoryVerified email at uic.edu
Daniel P. AbrahamArgonne National LaboratoryVerified email at anl.gov
Poya Yasaei, Ph.D., P.E., PMP, CFEIGoogle Corp.Verified email at google.com
Peter ZapolArgonne National LaboratoryVerified email at anl.gov
A T M Golam SarwarEngineering Manager, Spice ModelingVerified email at intel.com
D R CoughlinUnited States Steel CorporationVerified email at uss.com
Sohrab Ismail-BeigiYale UniversityVerified email at yale.edu
Fan YangThe Ohio State UniversityVerified email at osu.edu
Raymond R. UnocicAssociate Professor of Materials Science and Engineering, North Carolina State UniversityVerified email at ncsu.edu
Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu