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Bongsub Lee
Bongsub Lee
Other names(Bong-Sub Lee)
Director, Design, Analysis, & Technology Transfer, Adeia, Inc.
Verified email at adeia.com - Homepage
Title
Cited by
Cited by
Year
Investigation of the optical and electronic properties of Ge2Sb2Te5 phase change material in its amorphous, cubic, and hexagonal phases
BS Lee, JR Abelson, SG Bishop, DH Kang, B Cheong, KB Kim
Journal of applied physics 97 (9), 093509, 2005
4602005
Thermal conductivity of phase-change material Ge2Sb2Te5
HK Lyeo, DG Cahill, BS Lee, JR Abelson, MH Kwon, KB Kim, SG Bishop, ...
Applied physics letters 89 (15), 151904-151904-3, 2006
3622006
Observation of the role of subcritical nuclei in crystallization of a glassy solid
BS Lee, GW Burr, RM Shelby, S Raoux, CT Rettner, SN Bogle, ...
Science 326 (5955), 980-984, 2009
2042009
Low-temperature processing of B4C–Al composites via infiltration technique
BS Lee, S Kang
Materials chemistry and physics 67 (1), 249-255, 2001
1292001
Nanoscale nuclei in phase change materials: Origin of different crystallization mechanisms of Ge2Sb2Te5 and AgInSbTe
BS Lee, RM Shelby, S Raoux, CT Retter, GW Burr, SN Bogle, ...
Journal of Applied Physics 115 (6), 063506, 2014
772014
Observation and modeling of polycrystalline grain formation in Ge2Sb2Te5
GW Burr, P Tchoulfian, T Topuria, C Nyffeler, K Virwani, A Padilla, ...
Journal of Applied Physics 111 (10), 104308, 2012
732012
Electronic, optical and thermal properties of the hexagonal and rocksalt-like Ge2Sb2Te5 chalcogenide from first-principle calculations
T Tsafack, E Piccinini, BS Lee, E Pop, M Rudan
Journal of Applied Physics 110 (6), 063716, 2011
682011
Nanometer-scale order in amorphous Ge2Sb2Te5 analyzed by fluctuation electron microscopy
MH Kwon, BS Lee, SN Bogle, LN Nittala, SG Bishop, JR Abelson, ...
Applied physics letters 90, 021923, 2007
562007
STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREASED DENSITY
CG Woychik, AR Sitaram, A Cao, B Lee
US Patent 10,381,326 B2, 2019
472019
Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
G Gao, L Mirkarimi, G Fountain, L Wang, C Uzoh, T Workman, G Guevara, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 314-322, 2018
392018
Bonded structures
R Katkar, LW Mirkarimi, LEE Bongsub, GG Fountain Jr, CE Uzoh
US Patent 11,004,757, 2021
352021
Distribution of nanoscale nuclei in the amorphous dome of a phase change random access memory
BS Lee, K Darmawikarta, S Raoux, YH Shih, Y Zhu, SG Bishop, ...
Applied Physics Letters 104 (7), 071907, 2014
352014
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
G Gao, L Mirkarimi, T Workman, G Fountain, J Theil, G Guevara, P Liu, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 628-635, 2019
342019
Direct bond interconnect (DBI®) for fine-pitch bonding in 3D and 2.5 D integrated circuits
L Wang, G Fountain, B Lee, G Gao, C Uzoh, S McGrath, P Enquist, ...
2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2017
302017
Die to Wafer Stacking with Low Temperature Hybrid Bonding
G Gao, T Workman, C Uzoh, KM Bang, L Mirkarimi, J Theil, D Suwito, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 589-594, 2020
212020
Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment
G Gao, L Mirkarimi, T Workman, G Guevara, J Theil, C Uzoh, G Fountain, ...
2018 International Wafer Level Packaging Conference (IWLPC), 1-7, 2018
212018
Fluctuation Transmission Electron Microscopy: Detecting Nanoscale Order in Disordered Structures
BS Lee, SG Bishop, JR Abelson
ChemPhysChem 11 (11), 2311-2317, 2010
172010
Optical and electrical properties of phase change materials
BS Lee, SG Bishop
Phase Change Materials, 175-198, 2009
162009
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
G Gao, T Workman, L Mirkarimi, G Fountain, J Theil, G Guevara, C Uzoh, ...
2019 International Wafer Level Packaging Conference (IWLPC), 1-9, 2019
152019
Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermal Compression Bonding
G Gao, G Fountain, P Enquist, C Uzoh, L Wang, S McGrath, B Lee, ...
IWLPC, 2016
132016
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