Follow
Xuchen Zhang
Title
Cited by
Cited by
Year
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ...
International Journal of Heat and Mass Transfer 103, 1359-1370, 2016
992016
A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration
C Green, P Kottke, X Han, C Woodrum, T Sarvey, P Asrar, X Zhang, ...
Journal of Electronic Packaging 137 (4), 040802, 2015
752015
Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins
P Asrar, X Zhang, CE Green, M Bakir, YK Joshi
International Journal of Heat and Mass Transfer 121, 329-342, 2018
392018
Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps
MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ...
International Journal of Heat and Mass Transfer 108, 1702-1713, 2017
392017
Hotspot thermal management with flow boiling of refrigerant in ultrasmall microgaps
MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ...
Journal of Electronic Packaging 139 (1), 011006, 2017
262017
Heterogeneous Interconnect Stitching Technology With Compressible MicroInterconnects for Dense Multi-Die Integration
X Zhang, PK Jo, M Zia, GS May, MS Bakir
IEEE Electron Device Letters 38 (2), 255-257, 2017
232017
Benchmarking digital die-to-die channels in 2.5-D and 3-D heterogeneous integration platforms
Y Zhang, X Zhang, MS Bakir
IEEE Transactions on Electron Devices 65 (12), 5460-5467, 2018
202018
Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications
X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ...
Journal of Electronic Packaging 138 (1), 010910, 2016
182016
High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed
H Oh, X Zhang, GS May, MS Bakir
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 68-73, 2016
152016
Flow boiling of R245fa in a microgap with integrated staggered pin fins
P Asrar, X Zhang, CD Woodrum, CE Green, PA Kottke, TE Sarvey, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
142016
Silicon interposer with embedded microfluidic cooling for high-performance computing systems
L Zheng, Y Zhang, X Zhang, MS Bakir
IEEE Electronic Components and Technology Conference, 828-832, 2015
132015
Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs)
PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir
IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018
122018
Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins
P Asrar, X Zhang, CE Green, PA Kottke, TE Sarvey, A Fedorov, MS Bakir, ...
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016
112016
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II
X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir
IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016
102016
3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications
X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ...
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
102015
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i
V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi
IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016
92016
Memory cell
XX Li, C Meng, XC Zhang
US Patent 9,135,985, 2015
92015
Extreme-microgap (x-µgap) based hotspot thermal management with refrigerant flow boiling
MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
72016
Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins
X Zhang, MH Nasr, DC Woodrum, CE Green, PA Kottke, TE Sarvey, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
52016
Heterogeneous multi-die stitching: Technology demonstration and design considerations
PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018
42018
The system can't perform the operation now. Try again later.
Articles 1–20