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Yi-Shao Lai
Yi-Shao Lai
ASE Group
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Title
Cited by
Cited by
Year
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
YS Lai, PF Yang, CL Yeh
Microelectronics Reliability 46 (2-4), 645-650, 2006
2192006
Thermomigration in SnPb composite flip chip solder joints
AT Huang, AM Gusak, KN Tu, YS Lai
Applied Physics Letters 88 (14), 2006
1932006
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen
Materials Science and Engineering: A 485 (1-2), 305-310, 2008
1902008
Advanced flip chip packaging
HM Tong, YS Lai, CP Wong
Springer US, 2013
1552013
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization
YS Lai, YT Chiu, J Chen
Journal of Electronic Materials 37, 1624-1630, 2008
1152008
Semiconductor package and method for processing and bonding a wire
HC Chang, TY Tsai, YS Lai, HM Tong, JC Chen, WC Yih, CY Hung, ...
US Patent 8,053,906, 2011
1092011
Support excitation scheme for transient analysis of JEDEC board-level drop test
CL Yeh, YS Lai
Microelectronics Reliability 46 (2-4), 626-636, 2006
982006
Alloying modification of Sn–Ag–Cu solders by manganese and titanium
LW Lin, JM Song, YS Lai, YT Chiu, NC Lee, JY Uan
Microelectronics Reliability 49 (3), 235-241, 2009
942009
Stress–strain characteristics of tin-based solder alloys for drop-impact modeling
EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ...
Journal of Electronic Materials 37, 829-836, 2008
892008
Electromigration of Sn–37Pb and Sn–3Ag–1.5 Cu/Sn–3Ag–0.5 Cu composite flip–chip solder bumps with Ti/Ni (V)/Cu under bump metallurgy
YS Lai, KM Chen, CL Kao, CW Lee, YT Chiu
Microelectronics Reliability 47 (8), 1273-1279, 2007
892007
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
PF Yang, HC Wen, SR Jian, YS Lai, S Wu, RS Chen
Microelectronics Reliability 48 (3), 389-394, 2008
822008
Advances in the drop-impact reliability of solder joints for mobile applications
EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai
Microelectronics Reliability 49 (2), 139-149, 2009
792009
Evaluation of board-level reliability of electronic packages under consecutive drops
CL Yeh, YS Lai, CL Kao
Microelectronics Reliability 46 (7), 1172-1182, 2006
752006
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
YH Lin, TC Chen, PF Yang, SR Jian, YS Lai
Applied Surface Science 254 (5), 1415-1422, 2007
742007
Local melting induced by electromigration in flip-chip solder joints
CM Tsai, YL Lin, JY Tsai, YS Lai, CR Kao
Journal of electronic materials 35, 1005-1009, 2006
722006
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation
DL Chen, PF Yang, YS Lai
Microelectronics Reliability 52 (3), 541-558, 2012
712012
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
CW Chen, YS Lai, HC Chang, TY Tsai, PHC Chien, PC Hu, HY Lee
US Patent 8,115,285, 2012
712012
Characteristics of current crowding in flip-chip solder bumps
YS Lai, CL Kao
Microelectronics Reliability 46 (5-6), 915-922, 2006
712006
Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films
CY Yen, SR Jian, GJ Chen, CM Lin, HY Lee, WC Ke, YY Liao, PF Yang, ...
Applied surface science 257 (17), 7900-7905, 2011
692011
Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
FY Ouyang, KN Tu, YS Lai, AM Gusak
Applied Physics Letters 89 (22), 2006
682006
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Articles 1–20