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- Won Jong YooProfessor of Sungkyunkwan UniversityVerified email at skku.edu
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Daeyeong LeeSamsumg ElectronicsVerified email at samsung.com
- Xiaochi Liu 刘晓迟School of Physics, Central South UniversityVerified email at csu.edu.cn
- Ankur NipaneIntel CorporationVerified email at intel.com
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsVerified email at ti.com
- Deshun QuPh.D, SAINT, Sungkyunkwan UniversityVerified email at skku.edu
- Abhinandan BorahNavitas SemiconductorVerified email at navitassemi.com
- Young-Jun YuAssociate Professor, Department of Physics, Chungnam National UniversityVerified email at cnu.ac.kr
- Inyong MoonSungkyunkwan UniversityVerified email at skku.edu
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Bumho KimUniversity of PennsylvaniaVerified email at sas.upenn.edu
- Changsik KimSKKU Advanced Institute of Nano Technology, Sungkyunkwan UniversityVerified email at skku.edu
- Changgu LeeSungkyunkwan UniversityVerified email at skku.edu
- Tien Dat NgoimecVerified email at imec.be
- Seung Hwan Lee성균관대학교 나노과학기술대학원Verified email at skku.edu
- Younghun JungColumbia University, Postdoctoral Research ScientistVerified email at columbia.edu
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Min Sup Choi
Department of Materials Science and Engineering, Chungnam National University
Verified email at cnu.ac.kr - Homepage