| Air gap semiconductor structure with selective cap bilayer SM Gates, EE Huang, DR Kioussis, CJ Penny, D Priyadarshini US Patent 9,305,836, 2016 | 372 | 2016 |
| Vertically stacked gate-all-around Si nanowire transistors: Key process optimizations and ring oscillator demonstration H Mertens, R Ritzenthaler, V Pena, G Santoro, K Kenis, A Schulze, ... 2017 IEEE international electron devices meeting (IEDM), 37.4. 1-37.4. 4, 2017 | 122 | 2017 |
| Reactive nitrogen and phosphorus removal from aquaculture wastewater effluents using polymer hydrogels DR Kioussis, FW Wheaton, P Kofinas Aquacultural Engineering 23 (4), 315-332, 2000 | 113 | 2000 |
| Germanium etching systems and methods M Korolik, N Ingle, D Kioussis US Patent 10,043,674, 2018 | 94 | 2018 |
| Reactive phosphorus removal from aquaculture and poultry productions systems using polymeric hydrogels P Kofinas, DR Kioussis Environmental science & technology 37 (2), 423-427, 2003 | 79 | 2003 |
| Characterization of anion diffusion in polymer hydrogels used for wastewater remediation DR Kioussis, P Kofinas Polymer 46 (22), 9342-9347, 2005 | 70 | 2005 |
| Phosphate binding polymeric hydrogels for aquaculture wastewater remediation DR Kioussis, FW Wheaton, P Kofinas Aquacultural engineering 19 (3), 163-178, 1999 | 62 | 1999 |
| Characterization of network morphology in anion binding hydrogels used for wastewater remediation DR Kioussis, P Kofinas Polymer 46 (23), 10167-10172, 2005 | 42 | 2005 |
| Ammonium perchlorate–binding poly (allylamine hydrochloride) hydrogels for wastewater remediation DR Kioussis, DF Smith, P Kofinas Journal of applied polymer science 80 (11), 2073-2083, 2001 | 31 | 2001 |
| CPI Challenges to BEOL at 28nm Node and Beyond V Ryan, D Breuer, H Geisler, D Kioussis, MU Lehr, J Paul, K Machani, ... 2012 IEEE International Reliability Physics Symposium (IRPS), 2E. 1.1-2E. 1.6, 2012 | 19 | 2012 |
| Method for fabricating junctions and spacers for horizontal gate all around devices N Yoshida, L Dong, S Sun, M Kim, NS Kim, D Kioussis, M Korolik, ... US Patent 10,177,227, 2019 | 15 | 2019 |
| Evaluation of barrier CMP slurries and characterization of ULK material properties shifts due to CMP WT Tseng, D Kioussis, SL Manikonda, HK Kim, J Choi, F Zhao, ... ECS Transactions 13 (2), 293, 2008 | 6 | 2008 |
| Air gap structure with bilayer selective cap SM Gates, EE Huang, DR Kioussis, CJ Penny, D Priyadarshini US Patent App. 14/961,966, 2016 | 5 | 2016 |
| Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB F Chen, J Gambino, M Shinosky, J Aitken, E Huang, S Cohen, CC Yang, ... 2012 IEEE International Reliability Physics Symposium (IRPS), 3A. 3.1-3A. 3.9, 2012 | 5 | 2012 |
| Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies R Augur, C Child, JH Ahn, TJ Tang, L Clevenger, D Kioussis, H Masuda, ... Microelectronic engineering 92, 42-44, 2012 | 5 | 2012 |
| Air gap semiconductor structure with selective cap bilayer SM Gates, EE Huang, DR Kioussis, CJ Penny, D Priyadarshini US Patent 9,960,117, 2018 | 4 | 2018 |
| Method of forming an air gap semiconductor structure with selective cap bilayer SM Gates, EE Huang, DR Kioussis, CJ Penny, D Priyadarshini US Patent 9,711,455, 2017 | 4 | 2017 |
| Optimized interfacial strength for dense and porous SiCOH DD Restaino, S Molis, A Grill, VV Patel, MW Lane, T Cheng, A Demos, ... Advanced Metallization Conference, 2008 | 4 | 2008 |
| Multi-zone gas distribution systems and methods S Singh, KD Schatz, A Tso, M Wijekoon, D Kioussis US Patent 10,903,054, 2021 | 3 | 2021 |
| The strength of BEOL structures fabricated using low K materials and its impact on CPI failures TM Shaw, XH Liu, E Misra, D Questad, G Bonilla, T Wassick, M Lamorey, ... 2015 IEEE International Integrated Reliability Workshop (IIRW), 115-118, 2015 | 2 | 2015 |
