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Co-authors
Hooman MohseniNorthwestern UniversityVerified email at eecs.northwestern.edu
Omer G MemisIntel CorporationVerified email at intel.com
Dibyendu DeyEngineer at Microsoft CorporationVerified email at intel.com
Daniela R. RaduMECHANICAL AND MATERIALS ENGINEERINGVerified email at fiu.edu
Alok TayiPostdoctoral Fellow, Harvard UniversityVerified email at fas.harvard.edu
Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Alireza BonakdarNorthwestern UniversityVerified email at u.northwestern.edu
Ryan GelfandCREOL, UCFVerified email at u.northwestern.edu
John KohoutekIndustryVerified email at u.northwestern.edu
Zhiqiang Fang (方志强)South China University of Technology,State Key Laboratory of Pulping and Paper EngineeringVerified email at scut.edu.cn
Hongli ZhuAssociate Professor and Faculty Fellow, Northeastern UniversityVerified email at neu.edu
Liangbing HuUniversity of Maryland College ParkVerified email at umd.edu
Katherine E RoelofsIntel, DuPont, Stanford UniversityVerified email at stanford.edu
Jeffrey MethDuPontVerified email at dupont.com
Iman Hassani niaNorthwestern UniversityVerified email at u.northwestern.edu