Get my own profile
Co-authors
- Hooman MohseniNorthwestern UniversityVerified email at northwestern.edu
- Omer G MemisIntel CorporationVerified email at intel.com
- Dibyendu DeyEngineer at Microsoft CorporationVerified email at intel.com
- Daniela R. RaduMECHANICAL AND MATERIALS ENGINEERINGVerified email at fiu.edu
- Alok TayiPostdoctoral Fellow, Harvard UniversityVerified email at fas.harvard.edu
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Alireza BonakdarNorthwestern UniversityVerified email at u.northwestern.edu
- Ryan GelfandCREOL, UCFVerified email at u.northwestern.edu
- John KohoutekIndustryVerified email at u.northwestern.edu
- Zhiqiang Fang (方志强)South China University of Technology,State Key Laboratory of Pulping and Paper EngineeringVerified email at scut.edu.cn
- Hongli ZhuAssociate Professor, College of Enginnering Faculty Fellow, Northeastern UniversityVerified email at neu.edu
- Liangbing HuUniversity of Maryland College ParkVerified email at umd.edu
- Katherine E RoelofsIntel, DuPont, Stanford UniversityVerified email at stanford.edu
- Jeffrey MethDuPontVerified email at dupont.com
- Iman Hassani niaNorthwestern UniversityVerified email at u.northwestern.edu