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Hanju Oh
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Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs
Y Zhang, H Oh, MS Bakir
2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013
422013
Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
322014
In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation
X Liu, PA Thadesar, CL Taylor, H Oh, M Kunz, N Tamura, MS Bakir, ...
Applied Physics Letters 105 (11), 2014
262014
Biomimetic extracellular matrix coatings improve the chronic biocompatibility of microfabricated subdural microelectrode arrays
F Vitale, W Shen, N Driscoll, JC Burrell, AG Richardson, O Adewole, ...
PLoS One 13 (11), e0206137, 2018
252018
High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems
H Oh, JM Gu, SJ Hong, GS May, MS Bakir
Microelectronic Engineering 142, 30-35, 2015
242015
IEEE Trans. Elec. Dev.
JF Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir
IEEE Trans. Elec. Dev 63, 2510-2516, 2016
212016
Design, fabrication, and characterization of dense compressible microinterconnects
PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017
172017
High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed
H Oh, X Zhang, GS May, MS Bakir
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 68-73, 2016
152016
Low-loss air-isolated through-silicon vias for silicon interposers
H Oh, PA Thadesar, GS May, MS Bakir
IEEE Microwave and Wireless Components Letters 26 (3), 168-170, 2016
152016
A microwell-based impedance sensor on an insertable microneedle for real-time in vivo cytokine detection
N Song, P Xie, W Shen, H Oh, Y Zhang, F Vitale, M Javanmard, MG Allen
Microsystems & Nanoengineering 7 (1), 96, 2021
142021
Dynamic thermal management for 3-D ICs with time-dependent power map using microchannel cooling and machine learning
YS Li, H Yu, H Jin, TE Sarvey, H Oh, MS Bakir, M Swaminathan, EP Li
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019
142019
Electrical circuit modeling and validation of through-silicon vias embedded in a silicon microfluidic pin-fin heat sink filled with deionized water
H Oh, M Swaminathan, GS May, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
112020
Heterogeneous integrated microsystems with nontraditional through-silicon via technologies
H Oh, GS May, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017
112017
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II
X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir
IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016
102016
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i
V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi
IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016
92016
Fully additive fabrication of electrically anisotropic multilayer materials based on sequential electrodeposition
M Synodis, JB Pyo, M Kim, H Oh, X Wang, MG Allen
Journal of Microelectromechanical Systems 29 (6), 1510-1517, 2020
72020
Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICS with silicon interposer
H Oh, Y Zhang, L Zheng, GS May, MS Bakir
Heat Transfer Engineering 37 (11), 903-911, 2016
72016
Analysis of signal propagation through TSVs within distilled water for liquid-cooled microsystems
H Oh, GS May, MS Bakir
IEEE Transactions on Electron Devices 63 (3), 1176-1181, 2016
72016
Designing Surface Chemistry of Silver Nanocrystals for Radio Frequency Circuit Applications
H Oh, SW Lee, M Kim, WS Lee, M Seong, H Joh, MG Allen, GS May, ...
ACS applied materials & interfaces 10 (43), 37643-37650, 2018
62018
TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling
H Oh, Y Zhang, TE Sarvey, GS May, MS Bakir
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 1-4, 2016
62016
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Articles 1–20